描写
COOL-SILVER PAD™ Thermal Pad has a measurable performance advantage in dropping the semiconductor junction temperature with the same heat-sink and CPU. It contains more than 90% silver by weight, 0% silicone, and is RoHS compliant. The thermal resistance is lower than the known “industry standard” of <0.0045°C-in2/Watt @ 0.001 inch interface layer thickness. Side by side comparison with the best-known thermal interface materials for CPU applications demonstrated the superior performance of COOL-SILVER PAD™.
COOL-Silver PAD™ TIM与前几代银热界面材料不同，不会分离、跑偏、迁移或渗漏。尽管其导热性来自于高填充的纯银微粒，但它并不导电。
COOL-SILVER PAD™ Thermal Pad sticks slightly to metal surfaces on both sides for ease of application. It does not adhere to the release liners that are on both sides when packaged. To apply, peal off the bottom release liner (no tab) and apply the exposed pad to the CPU. Then smooth out the pad on the CPU by gently touching the top release liner with your finger to remove any air bubbles. Finally, remove the top release liner by pulling on the white tab. Then install the CPU cooler. You can also trim the pad before installing with sharp scissors on any edge, except for the white tab edge, for a perfect fit. COOL-SILVER PAD™ is 1.5 x 1.5 inches square to accommodate all processor sizes and is 3 thousandths of an inch (3 mils) thick.
AI科技在帮助军工、航天、计算机和超级计算机制造商提供热复合材料和热接口材料以制造最可靠的电子设备和计算机方面拥有超过25年的经验和成功案例。AI Technology现在正以其易于应用的COOL-SILVER PAD™最先进的热接口垫来服务于消费类PC社区。
