描写
COOL-GELFILM™ SZ是一种新型的热界面材料，它的分散性类似于薄膜，但其性能特性类似于热润滑脂或凝胶。COOL-GELFILM™ SZ是一种改性的氧化锌混合料，在正常电压下填充结晶物，具有电绝缘性，可用于大面积和间隙填充界面应用。它具有高的可压缩性和瞬间流动性，可提高功率器件与散热器之间的热传递。COOL-GELFILM SZ两面略带粘性，可实现最佳的瞬间热传导性能。
COOL-GELFILM™ SZ Thermal Pad sticks slightly to metal surfaces on both sides for ease of application. It does not adhere to the release liners that are on both sides when packaged. To apply, peel off the bottom release liner (no tab) and apply the exposed pad to the CPU. Then smooth out the pad on the CPU by gently touching the top release liner with your finger to remove any air bubbles. Finally, remove the top release liner by pulling on the white tab. Then install the CPU cooler. You can also trim the pad before installing with sharp scissors on any edge, except for the white tab edge, for a perfect fit. COOL-GELFILM™ SZ is 1.5 x 1.5 inches square to accommodate all processor sizes and is 3 thousandths of an inch (3 mils) thick.
AI Technology在帮助军工、航天、计算机和超级计算机制造商提供热复合材料和热接口材料以制造一些最可靠的电子设备和计算机方面拥有超过25年的经验和成功案例。AIT现在正以其易于应用的COOL-GELFILM™ SZ最先进的热接口垫来服务于消费类PC社区。
