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AIT has many proven epoxy paste and film adhesives for thermal and microwave ground plane management in component and substrate attachments. The ME8456 series of flexible conductive adhesives and TC8750 flexible film adhesive have been the mainstay of conductive adhesives used for microwave applications in military electronics with 20 years of proven success. The following are some representative products. For more details on paste or film adhesives and their applications, please go to the respective dedicated web pages.

FACTORS AFFECTING ADHESIVE RELIABILITY

 

Contributor
Adverse Factor
Favorable Factor
Molecular
Intimacy
-Oil & contaminates
-Weak surface oxides
-Low surface energy of adherends
-Lower surface tension adhesive
-Good adhesive flow
-High adherend surface energy
Internal
Stresses
-High modulus adhesive
-High CTE mismatch
-High adhesive Tg
-Low modulus adhesive
-Low CTE mismatch
-Low adhesive Tg
Operational
Environments
-Ionic impurities & moisture
-High moisture & temperature
-High temperature exposure
-Low temperature exposure
-Ionically clean
-Low moisture absorption
-High temperature adhesive stability
-Low Tg, high flexibility adhesive

 

 AIT, solve my problem!

 

 


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