COOL-BOND™ HB-2 (2 cc Kit - 1 cc part A, 1 cc part B)

COOL-BOND™ HB-2 is rapid ambient curing reworkable, thermally conductive and electrically insulating crystallite filled epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The very high thermal conductivity of this material makes it useful for bonding high-powered, large area dies and components.

COOL-BOND™ HB-2 has a medium bond strength and is easier to rework with reasonable torque for hobbyist use. It is not designed for applications requiring military grade or other excessive strength or extreme continuous moisture conditions.

Application Instructions:

(1) Store Part A and Part B at ambient temperature.
(2) Mix Part A (White) and Part B (Gray) 1:1 by weight or by volume within 20% until uniform color is achieved.
(3) Make sure that mixing is done within 2 minutes. Dispense/apply mixed adhesive and assemble parts within 5 minutes after mixing.

Note: If ambient temperature is above 25ºC, the adhesive will cure faster and the time available for dispensing and assembly may be shortened. Two PP mixing spatulas are provided that can be reused.