Visit Our Online Store to purchase COOL-SILVERTM thermal gel-grease
The bench-mark thermal performance measured illustrated above demonstrated more than 2-3 temperature centigrade lower junction temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.
AIT offers one of the most comprehensive thermal greases and thermal gels with the lowest thermal resistance ever documented. The following tables represent some of these innovative interface material solutions and advantages:
· The lowest thermal interface resistance greases and gels ever documented
· All non-silicone based and non-migrating designed for delicate electronics
· In-situ curing thermal interface gels are first in the industry
· Available as electrically conductive or electrically insulating versions.
The bench-mark thermal performance measured for an AIT non-silver based thermal interface gel (COOL-GEL®) illustrated above demonstrated more than 1 temperature centigrade lower junction temperatures over the industry "standards" of silver-based products even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.
|
AIT Product
|
Characteristics
|
Electrical Resistivity (ohm-cm)
|
Thermal Conductivity(watt/m-oC)
|
Dielectric
Strength (volt/mil) |
Die-shear (psi)
|
Tg (oC)
|
|
-Non-silicone thermal grease |
>1x1014 |
>2.0 |
N/A |
N/A |
Grease |
|
|
-Non-silicone thermal grease
-Boron Nitride Filled
|
>1x1014 |
>4.0 |
N/A |
N/A |
Grease |
|
|
-Non-silicone thermal grease
-Aluminum Nitride Filled
|
>1x1014 |
>4.0 |
N/A |
N/A |
Grease |
|
|
-Non-silicone thermal grease
-Diamond Filled
|
>1x1013 |
10.0 |
N/A |
N/A |
Grease |
|
|
-Non-silicone thermal gel
-Aluminum Oxide Filled
|
>1x1013 |
>2.0 |
300 |
<300 |
-60 |
|
|
-Non-silicone thermal gel
-Aluminum Nitride Filled
|
>1x1014 |
>4.1 |
300 |
<300 |
-60 |
|
|
-Non-silicone thermal gel
-Diamond Filled
|
>1x1014 |
>5.7 |
300 |
<300 |
-60 |
|
|
-Interface/Potting gel
-Boron Nitride Filled
|
>1x1014 |
>4.1 |
500 |
<300 |
-65 |
|
|
-Interface/Potting gel
-Aluminum Nitride Filled
|
>1x1014 |
>4.3 |
500 |
<300 |
-65 |
|
|
-Lowest thermal resistance
-Non-silicone thermal grease
|
Non-Conductive in Bulk |
>12 |
N/A |
N/A |
Grease |
AIT offers many other gels, greases, and other thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
|
AIT Product
|
Characteristics
|
Electrical Resistivity (ohm-cm)
|
Thermal Conductivity(watt/m-oC)
|
Die-shear (psi)
|
Tg (oC)
|
|
-Non-silicone thermal grease |
<5x10-3 |
>8.6 |
N/A |
Grease |
|
|
-Non-silicone thermal grease
-Lower cost solution
|
<1x10-3 |
>6.4 |
N/A |
Grease |
|
|
-Non-silicone thermal grease
-Very high thermal conductivity
|
<5x10-3 |
>12.9 |
N/A |
Grease |
|
|
-Form Gel @ 800C
-Ideal for Power Devices
|
<1x10-4 |
>8.6 |
<300 |
Gel |
|
|
-Silver Coated Copper filled
-Lower Cost option
|
<1x10-2 |
>8.6 |
<300 |
Gel |
|
|
-Non-silicone thermal gel |
<1x10-4 |
>8.6 |
<300 |
Gel |
The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature.
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