COOL-GELFILM™ is another innovation that is a thermal interface gel in the film format for ease of applications for critical thermal interfacing requiring high reliability without heat of provision of clips or pressure. This compressible and comformable thermal interface materials does not phase change but is pressure sensitive to provide immediate thermal interface performance.
COOL-GAPFILL™ is yet another enhanced thermal gap-filling materials that provides extreme thermal conductivity and thus unparalleled thermal interface resistance for board level multiple component thermal management. It is designed to provide conformability and compressibility to bridge the thermal gap of large boards and sensitive components. It is non-phase change and non-silicone and thus will not contaminate components. While one side remain dry but conformable for easy removal while the heat-sinking or heat-spreading side is pressure sensitive to provide the optimum thermal interface with low thermal impedance and thermal resistance.
AIT invites anyone interested to make compressible phase-change materials or to use it for electronic and device applications based on its US patent 6,496,373 to contact us for licensing.
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
COOL-GEL™, COOL-GREASE™, COOL-GELFILM™ and COOL-GELFILL™: Thermal Interfaces that Outperform
AIT offers a series of thermal interface materials with the most advanced lowest thermal resistance gap filling pads that have the conformal and compressibility to bridge the differential spaces of multiple components to the heat spreader or heatsink. The following are the key performance characteristics:
- Eliminate air gap between components and heatsink
- Conform to curvature and warp of matching surfaces
- Soft and ease of compressibility to height differential of multiple components
- Stress-free with outstanding mechanical shock absorbing
- COOL-GAPFILL™ DT series have one side dry to contact the heat generating component with the tacky PSA to the heat spreading or heatsink for ease of rework
- COOL-GAPFILL™ TT series have both side tacky PSA to both the heat generating components and the heat spreading or heatsink for lowest thermal impedance and yet retain relative ease of rework
COOL-GAPFILL™ DT and TT Series of GAP PAD THERMAL INTERFACE MATERIALS FOR BRIDGING BOARD TO HEAT SPREADER DIFFERENTIAL SPACES:
Gap Pad Thermal Interface Materials: COOL-GAPFILL DT Series
| AIT Part # | Thickness (mil/mm) | Heat Facing Dry Interface (mil/mm) | Cooling Facing PSA Interface (mil/mm) | Thermal Conductivity (W/m-°K) |
|---|---|---|---|---|
| COOL-GAPFILL™ DT-20 | 20/0.50 | 4/0.10 | 16/0.40 | >8 |
| COOL-GAPFILL™ DT-40 | 40/1.00 | 4/0.10 | 36/0.90 | >8 |
| COOL-GAPFILL™ DT-80 | 80/2.00 | 4/0.10 | 76/1.90 | >8 |
Gap Pad Thermal Interface Materials: COOL-GAPFILL TT Series
| AIT Part # | Thickness (mil/mm) | Heat Facing Dry Interface(mil/mm) | Cooling Facing PSA Interface (mil/mm) | Thermal Conductivity (W/m-°K) |
|---|---|---|---|---|
| COOL-GAPFILL™ TT-10 | 10/0.25 | 0, Both Sides PSA | 10/0.25 | >8 |
| COOL-GAPFILL™ TT-20 | 20/0.50 | 0, Both Sides PSA | 20/0.50 | >8 |
| COOL-GAPFILL™ TT-40 | 40/1.00 | 0, Both Sides PSA | 40/1.00 | >8 |
Electrically Insulating Thermal Gels and Greases
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Dielectric Strength (volt/mil) | Die-shear (psi) | Tg (°C) |
|---|---|---|---|---|---|---|
| COOL-GREASE® CGR7015 | -Non-silicone thermal grease -Aluminum Oxide filled | >1x1014 | >2.0 | N/A | N/A | Grease |
| COOL-GREASE® CGR7016 | -Non-silicone thermal grease -Boron Nitride Filled | >1x1014 | >4.0 | N/A | N/A | Grease |
| COOL-GREASE® CGR7013 | -Non-silicone thermal grease -Modified Zinc Oxide Filled | >1x1014 | >4.0 | N/A | N/A | Grease |
| COOL-GREASE® CGR7019-LB | -Non-silicone thermal grease -Diamond Filled | >1x1013 | 10.0 | N/A | N/A | Grease |
| COOL-GEL® CGL7015 | -Non-silicone thermal gel -Aluminum Oxide Filled | >1x1013 | >2.0 | 300 | <300 | -60 |
| COOL-GEL® CGL7013 | -Non-silicone thermal gel -Modified Zinc Oxide crystallite filled | >1x1014 | >4.1 | 300 | <300 | -60 |
| COOL-GEL® CGL7019-LB | -Non-silicone thermal gel -Diamond Filled | >1x1014 | >5.7 | 300 | <300 | -60 |
| COOL-GEL® CGL7056-XT | -Interface/Potting gel -Boron Nitride Filled | >1x1014 | >4.1 | 500 | <300 | -65 |
| COOL-GEL® CGL7058 | -Interface/Potting gel -Aluminum Nitride Filled | >1x1014 | >4.3 | 500 | <300 | -65 |
| COOL-SILVERTM | -Lowest thermal resistance -Non-silicone thermal grease | Non-Conductive in Bulk | >12 | N/A | N/A | Grease |
Electrically Conductive Thermal Gels and Greases
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) |
|---|---|---|---|---|---|
| ELECTRO-GREASE ELGR8501 | -Non-silicone thermal grease | <5x10-3 | >8.6 | N/A | Grease |
| ELECTRO-GREASE ELGR8517 | -Non-silicone thermal grease -Lower cost solution | <1x10-3 | >6.4 | N/A | Grease |
| COOL-GREASE CGR8010-XT | -Non-silicone thermal grease -Very high thermal conductivity | <5x10-3 | >12.9 | N/A | Grease |
| COOL-GEL® CGL8010-XT | -Form Gel @ 800C -Ideal for Power Devices | <1x10-4 | >8.6 | <300 | Gel |
| COOL-GEL® CGL8013-XT | -Silver Coated Copper filled -Lower Cost option | <1x10-2 | >8.6 | <300 | Gel |
| COOL-GEL® CGL8050 | -Non-silicone thermal gel | <1x10-4 | >8.6 | <300 | Gel |
AIT offers many other gels, greases, and other thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
