AI Technology, Inc.

• 1: Home
• 2: Company
• 3: Products & Solutions
  • 3.1: Die Attach Adhesive Solutions
    • 3.1.1: Die Attach Paste Adhesives
    • 3.1.2: Die Attach Film Adhesives
    • 3.1.3: Die Attach Adhesive FAQs
  • 3.2: Substrate and Component Attach
    • 3.2.1: Component & Substrate Attach Paste Adhesives
    • 3.2.2: Substrate Attach Film Adhesives
  • 3.3: Thermal Interface Materials & Insulated Metal Substrates
    • 3.3.1: Compressible Phase-Change Interfaces
    • 3.3.2: Thermal Film and Paste Adhesives
    • 3.3.3: Thermal Gels & Greases
    • 3.3.4: Insulated Metal Substrate Copper Clads & Pre-Preg
    • 3.3.5: Thermal Management Tips and FAQs
  • 3.4: Flexible and Advanced Circuit Substrate Materials
    • 3.4.1: Solderable Flexible 1 and 2-Sided Copper Laminates
    • 3.4.2: Low Pressure Copper Pre-Preg
    • 3.4.3: Advanced Circuit Substrate Materials
  • 3.5: Lid Seal Solutions
    • 3.5.1: Lid Seal Preforms
    • 3.5.2: Solderable Insulating Lids
  • 3.6: Dicing & Grinding Tapes and Greases
    • 3.6.1: Dicing Tapes
    • 3.6.2: Grinding Tapes and Greases
    • 3.6.3: Dicing & Grinding Tape FAQs
  • 3.7: Flip Chip Adhesive Bumps
  • 3.8: EMI/RFI Shielding & ESD Protection Materials
    • 3.8.1: Compressible Gasket Sheets
    • 3.8.2: Shielding Caulks and Adhesives
    • 3.8.3: Melt-Bonding Lid-Shield
    • 3.8.4: ESD Protection Coatings & Materials
    • 3.8.5: EMI Shielding Tips and FAQs
  • 3.9: MIL-STD 883C 5011.4 Compliant
  • 3.10: NASA Outgassing Compliant
  • 3.11: Custom Adhesive & Material Solutions
• 4: Contact
• 5: Resources & Glossary
  • 5.1: Adhesive Bonding Principle
  • 5.2: Rework Process
  • 5.4: Patents & IP
  • 5.5: ISO 9001:2000 Certification
• 7: News & Shows
  • 7.1: News Releases
  • 7.2: Newsletter-Adherent
• 8: Online Store
• 9: Employment
• 10: Legal

Visit Our Online Store AITMART.COM to purchase COOL-SILVER^TM thermal gel-grease

The bench-mark thermal performance measured illustrated above demonstrated more than 2-3 temperature centigrade lower junction temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.

AIT offers one of the most comprehensive thermal greases and thermal gels with the lowest thermal resistance ever documented. The following tables represent some of these innovative interface material solutions and advantages:

·         The lowest thermal interface resistance greases and gels ever documented

·         All non-silicone based and non-migrating designed for delicate electronics

·         In-situ curing thermal interface gels are first in the industry

·         Available as electrically conductive or electrically insulating versions.

The bench-mark thermal performance measured for an AIT non-silver based thermal interface gel (COOL-GEL^®) illustrated above demonstrated more than 1 temperature centigrade lower junction temperatures over the industry "standards" of silver-based products even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.

AIT offers many other gels, greases, and other thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. 

The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature.