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Thermally Conductive & Electrically Insulating Paste Adhesives

 

 

AIT Product
Characteristics
Electrical Resistivity
(ohm-cm)
Thermal Conductivity(watt/m-oC)
Die-shear (psi)
Tg (oC)
Viscosity
-Solvent free
-Stress free
>1x1014
>1.7
>1,800
-25
276,000
(cps@ 0.5 rpm)
 -Stress free
-Mismatched CTE's
>1x1014
>1.7
>2,400
-25
144,000
(cps@ 0.5 rpm)
-Stress free
-Diamond filled 
>1x1014
>11.4
>1,800
-25
310,000
(cps@ 0.5 rpm)
ME7638-RC
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
>1x1014
>3.0
>3,000
60
10,000
(cps@ 0.5 rpm)
TI >4.0
ME7658-RC
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
>1x1014
>3.0
>1,500
-25
60,000
(cps@ 0.5 rpm)
TI >3.0

 AIT offers many other thermally conductive paste and thermal interface adhesive materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. 

 

 

Electrically and Thermally Conductive Paste
 (Click on the Product for the TDS)

AIT Product
Characteristics
Electrical Resistivity
(ohm-cm)
Thermal Conductivity(watt/m-oC)
Die-shear

(psi)
Tg (oC)
Viscosity
-Stress free
-One or two component
-Large bonding areas
 <4x10-4     >6.0
>1,800
-20
300,000
(cps@ 0.5 rpm)
-Solvent free
-Stress free
 <4x10-4  >7.9 
>1,000
-20
60,00
(cps@ 2.5 rpm)
 -Stress free
-Mismatched CTE's
 <4x10-4    >7.9
>2,400
-25
144,000
(cps@ 0.5 rpm)
-Solder replacement
-Rapid curing
-Molecularly flexible
-More than 7 days pot-life
-Dispensible & screen printable
 <4x10-4  >6.0
>1,500
-20
15,000
(cps@ 0.5 rpm)

TI >4

 AIT offers many other Electrically and Thermally conductive paste and thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. 

 

Thermally Conductive & Electrically Insulating Films and Pads
 (Click on the Product for the TDS)

AIT  Product
Characteristics
Electrical
Resistivity
(ohm-cm)
Thermal
Conductivity
(watt/m-oC)
Die
shear
(psi)
Tg
(oC)
Film
Type
-Instant melt-tack >150°C (<10 psi)
-No curing required
-Low moisture absorption
-Passes NASA outgassing requirement
-Proven reliability for large area substrates

>1x1014

>4.0

 >1000 -55
Tack free dry film
Preforms
3-12 mils (thick) 

COOL-BOND®
CB7208-A
-Instant tack with 10 psi for 300 psi bond
-Insitu curing, no special curing process
-Passes NASA outgassing requirement
-Proven reliability for large area substrates

>1x1014

>3.6

750

-25
Tacky film
Preforms
3-12 mils (thick)
-Instant melt-tack >120°C (<10 psi)
-Curing without fixture and pressure
-Withstand >300°C short-term exposure
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirement
-Proven reliability for large area substrates
>1x1014
>2.0
 >1,500
-45
Tack free dry film
Preforms
3-12 mils (thick) 
-Tacky for instant placement without fixture
-Curing without fixture and pressure
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirement
-Proven reliability for large area substrates 
>1x1014
>2.0
 >1,500
-45
Tacky film
Preforms
3-12 mils (thick) 
-Tacky for instant placement without fixture
-Curing with fixture or low pressure
-Withstand high temperature excursion
-Molecularly flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Proven reliability for large area substrates
>1x1014
>3.6 
>1,500 
-20
Tacky film
Preforms
3-12 mils (thick)

AIT offers many other thermally conductive film and thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. 

 

 

 

Electrically and Thermally Conductive Films and Pads
(Click on the Product for the TDS)

AIT  Product
Characteristics
Electrical
Resistivity
(ohm-cm)
Thermal
Conductivity
(watt/m-oC)
Die
shear
(psi)
Tg
(oC)
Film
Type
-Instant melt-tack >120°C (<10 psi)
-Curing without fixture and pressure
-Withstand >150°C wire-bonding
-Low moisture absorption
-Meets MIL-STD-883 5011.4
-Proven reliability for large area bonding

<4x10-4

>6.0

>1,500

-45
Tack free dry film
Preforms
3-12 mils (thick) 
 
-Tacky for instant placement without fixture
-Curing with fixture or low pressure
-Withstand high temperature excursion
-Molecularly flexible for low interfacial stress
-Meets MIL-STD-883 5011.4
-Passes NASA outgassing requirements
-Proven reliability for large area substrates

<4x10-4
>8.0
 >1,500
-20
Tacky film
Preforms
3-12 mils (thick)  

AIT offers many other Electrically and Thermally conductive film adhesive materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. 

 

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The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature. 

 

 

 

 

 

 

(Click on the Product for the TDS)

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