Thermal Tape Adhesives, Thermal Film Adhesives And Thermal Adhesives
AIT has one of the most comprehensive thermal adhesives for applications of different dispensing and placement condition, operating environment and performance requirements:
- Compressible and curing pressure sensitive thermal adhesive tapes and films
- Dry thermal epoxy tapes for high volume pick and place film adhesive applications
- Tacky thermally conductive epoxy film adhesives for ease of component positioning
- Instant melt-bonding thermally conductive film adhesives for ultimate productivity
- One-component heat curing thermal epoxies
- Two-component ambient curing thermal epoxies
AIT thermal tape adhesives and thermal adhesive pastes have been used extensively for high performance power devices, military and space modules over the last 26 years.
Film thermal adhesives and thermal tape adhesives are available in die-cut format packaged in preforms or roll-to-roll presentation.
AIT provides die cutting services of thermal adhesive tapes and films including the use of rotary die for ultimate volume requirement, laser die-cut for specialty and stringent formats, automated and programmable dicing and standard steel-rule die for extra high thickness.
Pressure sensitive thermal tape adhesives that provide instant bonding of more than 100 psi and dissipate heat with high efficiency as applied. Non-curing versions will remains the same pressure sensitive state while curing versions will insitu cure during usage for beyond 1000 psi while maintaining the molecular flexible for stress free interface.
"The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature!"
AIT offers many other Electrically and Thermally conductive film adhesive materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. AIT has a team of experienced engineers, scientists, sales and service staff ready to serve your needs for any electronic and semi-conductor packaging material solutions. We pride ourselves to provide products that meet your needs.
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Thermal Adhesive Tapes and Films and Thermal Adhesive Pastes for Ultimate Performance and Operating in Extreme Environments
AIT provides a comprehensive lines of thermal adhesives with low to zero interface stresses along the bondline for proven long-term reliability in over 25 years. These thermal adhesives include: thermal epoxies in tape adhesive (film adhesive) form factors, thermal epoxies in dispensible paste form factors for managing thermal dissipation in die, component and module levels of electronic packaging.
Thermal Adhesives and Thermal Epoxies in Dispensible Pastes Form Factors
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity |
|---|---|---|---|---|---|---|
| ME7155 |
|
>1x1014 | >1.7 | >1,800 | -25 | 276,000 (cps@ 0.5 rpm) |
| ME7156 |
|
>1x1014 | >1.7 | >2,400 | -25 | 144,000 (cps@ 0.5 rpm) |
| ME7159 |
|
>1x1014 | >11.4 | >1,800 | -25 | 310,000 (cps@ 0.5 rpm) |
| ME7638-RC |
|
>1x1014 | >3.0 | >3,000 | 60 | 10,000 (cps@ 0.5 rpm) TI >4.0 |
| ME7658-RC |
|
>1x1014 | >3.0 | >1,500 | -25 | 60,000 (cps@ 0.5 rpm) TI >3.0 |
Electrically and Thermally Conductive Thermal Epoxies in Dispensible Paste Form Factors
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity |
|---|---|---|---|---|---|---|
| EG8050 |
|
<4x10-4 | >6.0 | >1,800 | -20 | 300,000 (cps@ 0.5 rpm) |
| ME8456-00 |
|
<4x10-4 | >12.5 | >1,200 | -20 | 60,00 (cps@ 2.5 rpm) |
| ME8456-LV GS002 |
|
<4x10-4 | >7.9 | >2,400 | -25 | 144,000 (cps@ 0.5 rpm) |
| ME 8650-RC |
|
<4x10-4 | >6.0 | >1,500 | -20 | 15,000 (cps@ 0.5 rpm) TI >4 |
Thermally Conductive & Electrically Insulating Thermal Tapes and Thermal Pads in Film Adhesive Form Factors
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity (watt/m-°C) | Die shear (psi) | Tg (°C) | Film Type |
|---|---|---|---|---|---|---|
| COOL-BOND® CP7138 |
|
>1x1014 | >4.0 | >1000 | -55 | Tack free dry film Preforms 3-12 mils (thick) |
| COOL-BOND® CB7208-A |
|
>1x1014 | >3.6 | 750 | -25 | Tacky film Preforms 3-12 mils (thick) |
| ESP7455 |
|
>1x1014 | >2.0 | >1,500 | -45 | Tack free dry film Preforms 3-12 mils (thick) |
| RTK7555 |
|
>1x1014 | >2.0 | >1,500 | -45 | Tacky film Preforms 3-12 mils (thick) |
| RTK7553 |
|
>1x1014 | >3.6 | >1,500 | -20 | Tacky film Preforms 3-12 mils (thick) |
Electrically and Thermally Conductive Pads and Tape Adhesives in Film Form Factors
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity (watt/m-°C) | Die shear (psi) | Tg (°C) | Film Type |
|---|---|---|---|---|---|---|
| ESP8450-WL |
|
<4x10-4 | >6.0 | >1,500 | -45 | Tack free dry film Preforms 3-12 mils (thick) |
| RTC8750 |
|
<4x10-4 | >8.0 | >1,500 | -20 | Tacky film Preforms 3-12 mils (thick) |
