Stress-Free Insulated Metal Substrate with Lowest Thermal Resistance for Large Area and High Power Modules
AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716) applied to insulated metal substrates (IMS) differs from traditional IMS thermal circuit substrate in the following aspects to give them the unparalleled thermal and reliability performance:
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Instead of a thermally conductive rigid fiberglass epoxy laminate, we use our proprietary flexible thermal dielectric insulating layer resulting in stress and warp-free thermal copper-clad laminates.
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Unparalleled thermal conductivity in the insulating layer by eliminating the fiberglass fabrics.
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High temperature stability to withstand soldering at 300°C.
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Multi-layer capability with the same flexible dielectric copper-clad pre-preg that can be laminated at less than 14 psi pressure and at 125°C or higher.
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Base metal plates with choices of aluminum and copper from 35 mils to 350 mils.
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Thinner insulated metal substrate (IMS) and pre-preg are available in rolls of 24-inch width.
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Thicker insulated metal substrate (IMS) and pre-preg are available in sheets of 24-inch by 24-inch.
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Ideal for power and LED components, modules.
Single-Sided Insulated Metal Substrate (IMS) for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness (oz) |
Thermal Resistance(oC/W-in2) |
Nominal Stack Thickness (mils) | Dielectric Strength of Insulating Layer (Volt/mil) |
Dielectric Constant of Insulating Layer |
| COOL-CLADTM CC-AL-SS-1 |
-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300oC soldering |
1 | <1.5 | 88 | >1000 | 4.5 |
| COOL-CLADTM CC-AL-SS-4 |
-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300oC soldering |
4 | <1.5 | 162 | >1000 | 3.9 |
| COOL-CLADTM CC-AL-SS-10 |
-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300oC soldering |
10 | <1.5 | 312 | >1000 | 3.9 |
| COOL-CLADTM CC-AL-SS-X |
-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300oC soldering |
Custom | <1.5 | Custom | >1000 | 3.9 |
| COOL-CLADTM CC-AL-OX-SS-10 |
-Flexible thermal dielectric -Aluminum Clad -Laser Machineable -Withstand 300oC soldering |
10 | <1.5 | 312 | >3000 | 3.9 |
| COOL-CLADTM CC-AL-OX-SS-X |
-Flexible thermal dielectric -Aluminum Clad -Laser Machineable -Withstand 300oC soldering |
Custom | <1.5 | Custom | >3000 | 3.9 |
Double-Sided Copper-Clad Laminates for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness (oz) |
Thermal Resistance( oC/W-in2) |
Nominal Stack Thickness (mils) | Dielectric Strength of Insulating Layer (Volt/mil) |
Dielectric Constant of Insulating Layer |
| COOL-CLADTM CC-CU-DS-1 |
-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300oC soldering |
1 | <1.1 | 88 | >1000 | 3.9 |
| COOL-CLADTM CC-CU-DS-4 |
-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300oC soldering |
4 | <1.1 | 162 | >1000 | 3.9 |
| COOL-CLADTM CC-CU-DS-10 |
-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300oC soldering |
10 | <1.1 | 312 | >1000 | 3.9 |
| COOL-CLADTM CC-CU-DS-X |
-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300oC soldering |
Custom | <1.1 | Custom | >1000 | 3.9 |
| COOL-CLADTM CC-CU-OX-DS-X |
-Flexiblethermal dielectric -Copper-clad Base Plate -Laser Machineable -Withstand 300oC soldering |
Custom | <1.1 | Custom | >3000 | 3.9 |
Flexible Thermal Copper-clad Pre-preg for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness (oz) |
Thermal Resistance(oC/W-in2) |
Nominal Stack Thickness (mils) | Dielectric Strength of Insulating Layer (Volt/mil) |
Dielectric Constant of Insulating Layer |
| COUPLERTM TPR-CU-1 |
-Flexible thermal dielectric -Lamination Flow @>125oC and <14 psi -Withstand 300oC soldering |
1 | <1.1 | 88 | >1000 | 3.9 |
| COUPLERTM TPR-CU-2 |
-Flexible thermal dielectric -Lamination Flow @>125oC and <14 psi -Withstand 300oC soldering |
2 | <1.1 | 115 | >1000 | 3.9 |
| COUPERTM TPR-CU-X |
-Flexible thermal dielectric -Lamination Flow @>125oC and <14 psi -Withstand 300oC soldering |
Custom | <1.1 | Custom | >1000 | 3.9 |
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SOLDERABLE FLEXIBLE CIRCUIT COPPER CLAD LAMINATE
(COUPLER-C)
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