Wafer and Substrate Thinning Temporary Bonding Wax Coating and Wax Film

Please inform us of your requirements using the Contact tab or click on the button below:

AIT, solve my problem!

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308. AIT application engineering, sales, chemists, and material scientists are ready to serve your special needs and applications.

 

BACKGRINDING & THINNING TEMPORARY BONDING “IPA-WAX” SPIN-COATING AND ADHESIVE FILM SOLUTIONS for WAFERS and SUBSTRATES

  • Spin Coating IPA Wax Solution for 2-15 Micron Temporary Bonding
  • IPA Soluble Temporary Bonding Films of 12 and 25 Micron
  • Ideal as protective coating for protecting wafer surface against KOH and other chemical etching processes
  • Reversible bonding and debonding with simple mechanical slip push at moderate temperature above the melting point of the IPA soluble wax

Specialty substrate such as Sapphire submout for LED and specialty wafer may need to be thinned before front-end semiconductor processing, temporary bonding wax that can be spin-coated or film melt-bonding and easily removed with IPA solvent are some of the proven and tried solutions. AIT provides such solution that can be withstand temperature of operations up to 75°C and 125°C respectively.

In addition to its proven record of usage and unparalleled feats of high vacuum, high temperature and low thermal resistance, AIT temporary bonding adhesives are the most comprehensive material solutions innovated and manufactured in the United States.  AIT has extensive experience using high tech materials and chemists to formulate and customize temporary bonding materials and solutions for the critical semi-conductor and microelectronic operations of thinning for advanced operations and performance.

  1. Pioneering and proven high temperature controlled peel and UV release tapes for operations at temperatures from 150°C to as high as 250°C for short periods.
  2. For LED sub-mount thinning, wafer rough and fine grinding with IPA solution temporary adhesive leaves absolutely no residuals post grinding. Bonding and debonding with minimum vacuum or mechanical pressure of less than 10 psi at temperatures of 90-125°C. AIT provides large area film “wax” (IPA solution) with the same performance and ease of cleaning.
  3. Proven solution in temporary bonding thermal grease-gel including “industry-standard” high vacuum etching, CGR7016 and CGR7018, and melt-bonding electro-thermal film pads including CB8130, CPR8850, etc.
  4. Ultra-low water absorption and sensitivity.
  5. RoHS, REACH and WEEE compliant.
  6. AIT's team of engineers, chemists and material scientists stand ready to help select and customize a temporary bonding solution for specific processing parameters.

The extensive AIT reversible temporary bonding solutions are engineered specifically for the processing of compound semiconductors that often require back-thinning of the processed wafers or backside lithography. Wafers of GaAs, InP, SiC and other compounds are expensive and have relatively poor mechanical properties.

AIT's reversible bonding wax film and spin coating solution are also ideal for carrier or submount substrate back-thinning and backside lithography processing. These carrier or submount substrates are typically sapphire, quartz, glass, or in some cases Si wafers.

 

Spin-Coating Temporary Bonding IPA-Soluble Wax Solutions

  • 50% solid version (BGL7080) for 5-15 micron spin coating
  • 25% solid version (BGL7080-STI) for 2-10 micron spin coating
  • Ideal for precision thickness wafer and substrate thinning
  • Ideal as protective coating of wafers for KOH and other chemical etching processes
  • IPA soluble and carrying solvent for safe and convenient operation
  • Water resistance enables cooling for high pressure fast grinding operation
  • Withstand hours of high temperature processing of 200 °C under vacuum without degradation
  • Simple slip push at elevated temperatures above the melting point of wax bonding
  • Reversible bonding and debonding
  • Non-silicone and non-contaminating

While traditional waxe used for temporary bonding are petroleum based and must used more aggressive solvents that are objectionable, AIT engineered and provides a series of Iso-propanol (IPA) solution "waxes" in the spin-coating solution or thin-film formats. The operational temperatures of the series of products include up 75°C and up to 125°C.

 

Properties of AIT BACK-GRINDING and THINNING "WAX" Spin-Coating Solutions

PARAMETER

BGL-7080

BGL-7080-STI

BGL-7160

Release Mechanism-Material and Thickness

Melt and Mechanical Slipping Debonding

Melt and Mechanical Slipping Debonding

Melt and Mechanical Slipping Debonding

Carrier Support Film and Thickness

  • None
  • None
  • None

Thickness of Temporary Bonding Layer

  • 5-25 micron by spinning
  • 2-10 Micron by spin coating
  • 2-15 Micron Thick by spin coating

Die-Shear Bond Strength (PSI)

  • >500 psi
  • >500 psi
  • >500 psi

Operational Temperature Capability

  • Up to 75°C
  • Up to 75°C
  • Up to 125°C

De-Bonding Temperature and Mechanism

  • 120°C with slipping push
  • 120°C with slipping push
  • 160°C with slipping push

Cleaning Media

Iso-propanol (IPA)

Iso-propanol (IPA)

Iso-propanol (IPA)

Water Jet Resistance

Outstanding

Outstanding

Outstanding

Note #1: All backgrinding and thinning temporary materials are free of silicones or siloxanes.

Note #2: Anti-static versions are available for all of the UV, heat or peel release temporary bonding.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pre-Formed Temporary Bonding IPA-Soluble "Wax" Films

  • 12 and 25 micron thick flexible preformed film to melt-bond instantly
  • Ideal for precision thickness wafer and substrate thinning
  • Ideal for vacuum lamination on wafer surface to protect against the KOH and other chemical etching processes
  • IPA soluble and carrying solvent for safe and convenient operation
  • Water resistance enables cooling for high pressure fast grinding operation
  • Non-silicone and non-contaminating
  • Withstand hours of high temperature process of 200 °C under vacuum without degradation
  • Reversible temporary bonding that cleans easily with simple Iso-Propanol (IPA)

The same series of Iso-propanol (IPA) solution "waxes" in the spin-coating solution are also available for some operations that preferred to use instant melt-bondable films. The operational temperatures of the series of products also include up 75°C and up to 125°C.

 

Properties of AIT BACK-GRINDING and THINNING "WAX" Films

PARAMETER

BGF-7160

BGF-7120

Release Mechanism-Material and Thickness

Melt and Mechanical Slipping Debonding

Melt and Mechanical Slipping Debonding

Carrier Support Film and Thickness

  • None
  • None

Thickness of Temporary Bonding Layer

  • 12 Micron Thick Version
  • 25 Micron Thick Version
  • 12 Micron Thick Version
  • 25 Micron Thick Version

Die-Shear Bond Strength (PSI)

  • >500 psi
  • >500 psi

Operational Temperature Capability

  • Up to 125°C
  • Up to 90°C

De-Bonding Temperature and Mechanism

  • 160°C with slipping push

 

  • 120°C with slipping push

Cleaning Media

Iso-propanol (IPA)

Iso-propanol (IPA)

Water Jet Resistance

Outstanding

Outstanding

Note #1: All backgrinding and thinning temporary materials are free of silicones or siloxanes.

Reversible temporary bonding with vacuum lamination process of less than minus 14 psi.

Note #2: Anti-static versions are available for this reversible melt-flowable temporary bonding.

 

AIT engineers, sales personnel, chemists, and material scientists are ready to serve your special needs and applications. Please inform us of your requirements using the Contact tab or click on the button below:

AIT, solve my problem!

 

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308