AIT Backgrinding Tape General Features:
- Non-contaminating low ionic adhesive that is engineered for wafer thinning application
- Strong adhesion to wafer with hydrophobic property to prevent water seepage for stable consistent Backgrinding
- Consistent bond strength during grinding process
- Withstand high temperature and maintain high temperature peel strength
- On-Demand ease to peel release upon UV exposure
- Proven for wafer, panel of modules, glass and other substrate
- Adhesive-compliant buffer layer of 500 micron on strong transpareent substrate for solder-bumped wafer thinning
- 100 micron adhesive layer on strong transparent substrate for gold-bumped wafer thining
COOL-GREASE Wafer Thinning Vacuum Grease Adhesives:
Besides the more back grinding tapes, AIT thermal grease adhesives have been used extensively worldwide for thinning wafer under high vacuum.
Products Line-UP:
1. COOL-GREASE 7018
- Aluminum nitride filled
- Outstanding thermal conductivity of 4 W/m-K
- Outstanding stability under temperature of up to 100°C
- Proven capability for use under high vacuum
- Ease to remove and clean
2. COOL-GREASE 7013
- Anti-static with semi-conductive characteristics
- Modified zinc oxide filled
- Outstanding thermal conductivity of >4 W/m-K
- Outstanding stability under temperature of up to 100°C
- Proven capability for use under high vacuum
- Ease to remove and clean
3. COOL-GREASE 7016
- Boron nitride filled
- Outstanding thermal conductivity of >3 W/m-K
- Outstanding stability under temperature of up to 100°C
- Proven capability for use under high vacuum
- Ease to remove and clean
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Made-In-Usa Back Grinding Tapes And Greases For Worldwide Applications
While AIT high temperature back-grinding tapes are unique in the industry by having the ability to maintain consistent bond strength to wafer at high temperature to 200°C. Both UV-releasing type and high temperature controlled peel strength types are available for optimizing specific applications.
High Temperature Grinding Tapes with Controlled Release
Anti-static, controlled peel strength tapes for up to 300°C intermittent use
Major Distinguishing Characteristics:
- Can be used intermittently for up to 300°C and under some specific strong etching solutions.
- Absolutely silicone-free and 0% contamination transfer before and after dicing operation.
- Holding on diced parts even after prolonged exposure and immersion in water.
- Same peel strength before and after transportation after more than 30 days of mounting.
- Inherently anti-static independent of moisture condition of the ambient.
- Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.
- 100 micron and 500 micron adhesive-compliant layer to accommodate gold-bumped and solder-bumped wafer for accurate and stress-free thinning.
| AIT Product | Adhesion Strength (Peel, gm/in) | Adhesive/Buffer Thickness (Micron) | Backing Material Thickness (Micron) | Compressibility [ ] | Tensile Strength (Kg/cm) |
|---|---|---|---|---|---|
| BG-FC-HTCR 250 (Single-Sided) | 250 | 100/0 | 125 | [>50 micron] | >200 |
| BG-SB-HTCR 500 (Single-Sided) | 500 | 100/500 | 125 | [>250 micron] | >200 |
| HTCR 250-GDS (Double-Sided) | 250 | 100 | 125 | [>50 micron] | >200 |
| HTCR 500-GDS (Double-Sided) | 500 | 100 | 125 | [>50 micron] | >200 |
UV Activated Release Grinding Tapes
Anti-static, controlled peel strength tapes for up to 100°C intermittent use
Major Distinguishing Characteristics:
- Can be used intermittently for up to 100°C and under some specific strong etching solutions.
- Absolutely silicone-free and free of contamination transfer before and after dicing operation.
- Holding on diced parts even after prolonged exposure and immersion in water.
- Same peel strength and UV activated releasing property before and after transportation after more than 30 days of mounting.
- Inherently anti-static independent of moisture condition of the ambient.
- 100 Micron and 500 micron thick adhesive-buffer layer for gold-bumped and solder-bumped wafers thinning.
- Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.
NOTES:
- Other thickness may be made to special order.
- All of the compressible backing films based are proprietary technology, high temperature stable, and non-silicone flexible thermosetting resins.
- Some of the adhesive may tolerate strong acid etchant.
| AIT Product | Adhesion Before UV Exposure (Peel, gm/in) | Adhesion After UV Exposure (Peel, gm/in) | Adhesive/Buffer Thickness (Micron) | Backing Material Thickness (Micron) | Compressibility [ ] | Tensile Strength (Kg/cm) | Special Characteristics |
|---|---|---|---|---|---|---|---|
| BG-FC-UVR500 | 500 | 20 | 100 | 125 | [>50 micron] | >200 |
|
| BG-SB-UVR | 500 | 20 | 100/500 | 125 | [>250 micron] | >200 |
|
Melt-Bonding Wafer-Substrate Dicing Film
Major Distinguishing Characteristics:
1. Absolutely silicone-free.
2. All adhesives may be removed and free of contamination transfer after dicing operation.
3. Holding on diced parts even after prolonged exposure and immersion in water.
4. Same peel strength and removal property before and after transportation for more than 30 days after mounting.
5. Inherently anti-static independent of moisture condition of the ambient.
6. Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.
| AIT Product | Push-Off Strength (Die-Shear, psi) | Max. Load Bearing Temp. (°C) | "Melt-Bonding" Temperature & Lamination Process (@14-15psi) |
|---|---|---|---|
| CB7060 (Single ply melt-bonding adhesive film) | >1,000 | 60 |
|
| CB7130 (Single ply melt-bonding adhesive film) | >1,000 | 130 |
|
| CB7350-S (High-tack single-sided adhesive film on a temperature stable liner) | >300 | 150 (Continuous & 300 @5 min.) |
|
| CB7350-B (High-tack double-sided adhesive film on a temperature stable liner) | >300 | 150 (Continuous & 300 @5 min.) |
|
| CB7065 (Thermally conductive, single ply melt-bonding adhesive film) | >1,000 | 60 |
|
| CB7135 (Thermally conductive, single ply melt-bonding adhesive film) | >1,000 | 130 |
|
| TK7355-SS (High-tack single-sided adhesive film on a high thermal conductivity film liner) | >300 | 150 (Continuous & 300 @5 min.) |
|
Parts may be removed at temperature same or higher than the lamination temperatures of 70°C for CB7065 and 130°C for CB7135. Follow by suitable solvents (Please consult AIT engineering assistance) for complete dissolution cleaning. Proprietary cleaning solvent is used to remove diced parts for TK7355. Part-on-liner may be placed on a suitable wire-rack and soaked in solvent bath sequence for complete dissolution and cleaning of adhesive residue
