High Temperature Dicing-Grinding Tapes with Controlled Release
Anti-static, controlled peel strength tapes for up to 300°C intermittent use
Major Distinguishing Characteristics:
1. Can be used intermittently for up to 300°C and under some specific strong etching solutions.
2. Absolutely silicone-free and 0% contamination transfer before and after dicing operation.
3. Holding on diced parts even after prolonged exposure and immersion in water.
4. Same peel strength before and after transportation after more than 30 days of mounting.
5. Inherently anti-static independent of moisture condition of the ambient.
6. Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.
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Dicing & Grinding Tapes for High Temperature
Anti-static, controlled peel strength tapes for up to 300°C intermittent use |
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AIT
Product
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Adhesion Strength
(Peel, gm/in)
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Adhesive
Thickness
(Micron)
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Liner Material
Thickness
(Micron)
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Elongation
(%)
Expandability
[ ]
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Tensile Strength
(Kg/cm)
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HTCR 250
(Single-Sided)
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250
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25
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75
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>100
[Good]
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>200
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HTCR 500
(Single-Sided)
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500
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25
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75
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>100
[Good]
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>200
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HTCR 250-DS
(Double-Sided)
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250
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25
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75
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>100
[Good]
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>200
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HTCR 500-DS
(Double-Sided)
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500
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25
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75
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>100
[Good]
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>200
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UV Activated Release Dicing & Grinding Tapes
Anti-static, controlled peel strength tapes for up to 100°C intermittent use
Major Distinguishing Characteristics:
1. Can be used intermittently for up to 100°C and under some specific strong etching solutions.
2. Absolutely silicone-free and free of contamination transfer before and after dicing operation.
3. Holding on diced parts even after prolonged exposure and immersion in water.
4. Same peel strength and UV activated releasing property before and after transportation after more than 30 days of mounting.
5. Inherently anti-static independent of moisture condition of the ambient.
6. Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.
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UV Activated Release Dicing-Grinding Tapes
(BASIC PRODUCT PROPERTIES)
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AIT
Product
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Adhesion Before UV Exposure
(Peel, gm/in)
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Adhesion After UV Exposure
(Peel, gm/in)
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Adhesive
Thickness
(Micron)
|
Liner Material
Thickness
(Micron)
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Elongation
(%) Expandability
[ ]
|
Tensile Strength
(Kg/cm)
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Special Characteristics
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UVR 500
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500
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20
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25
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75
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>100
[Good]
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>200
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§ Withstand 100°C continuous usage
§ Silicone-Free
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NOTES:
Ø Other thickness may be made to special order.
Ø All of the stretchable films based are proprietary technology, high temperature stable, and non-silicone flexible thermosetting resins.
Ø Some of the adhesive may tolerate strong acid etchant.
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Melt-Bonding Wafer-Substrate Dicing Film
Major Distinguishing Characteristics:
1. Absolutely silicone-free.
2. All adhesives may be removed and free of contamination transfer after dicing operation.
3. Holding on diced parts even after prolonged exposure and immersion in water.
4. Same peel strength and removal property before and after transportation for more than 30 days after mounting.
5. Inherently anti-static independent of moisture condition of the ambient.
6. Tight tolerance of controlled release within 25% of peel strength specification for controlled manufacturing.
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Melt-Bonding Wafer-Substrate Dicing-Grinding Film
(BASIC PRODUCT PROPERTIES)
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AIT
Product
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Push-Off Strength
(Die-Shear, psi)
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Max. Load Bearing Temp. (°C)
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“Melt-Bonding” Temperature & Lamination Process
(@14-15psi)
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CB7060
(Single ply melt-bonding adhesive film)
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>1,000
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60
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§ >70°C with heated roll laminator with proper “foam” support
§ >70°C with “vacuum bagging”
§ Low ionic and ease of total removal
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CB7130
(Single ply melt-bonding adhesive film)
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>1,000
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130
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§ >130°C with heated roll laminator with proper “foam” support
§ >130°C with “vacuum bagging”
§ Low ionic and ease of total removal
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CB7350-S
(High-tack single-sided adhesive film on a temperature stable liner)
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>300
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150
(Continuous & 300 @5 min.)
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§ Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment
§ Low ionic and ease of total removal with suitable solvent
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CB7350-B
(High-tack double-sided adhesive film on a temperature stable liner)
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>300
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150
(Continuous & 300 @5 min.)
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§ Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment
§ Low ionic and ease of total removal with suitable solvent
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Wafer-Substrate Part Removal-Cleaning
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§ Parts may be removed at temperature same or higher than the lamination temperatures of 70°C for CB7065 and 130°C for CB7135. Follow by suitable solvents (Please consult AIT engineering assistance) for complete dissolution cleaning.
§ Proprietary cleaning solvent is used to remove diced parts for TK7355. Part-on-liner may be placed on a suitable wire-rack and soaked in solvent bath sequence for complete dissolution and cleaning of adhesive residue
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CB7065
(Thermally conductive, single ply melt-bonding adhesive film)
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>1,000
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60
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§ >70°C with heated roll laminator with proper “foam” support
§ >70°C with “vacuum bagging”
§ Low ionic and ease of total removal
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CB7135
(Thermally conductive, single ply melt-bonding adhesive film)
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>1,000
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130
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§ >130°C with heated roll laminator with proper “foam” support
§ >130°C with “vacuum bagging”
§ Low ionic and ease of total removal
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TK7355-SS
(High-tack single-sided adhesive film on a high thermal conductivity film liner)
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>300
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150
(Continuous & 300 @5 min.)
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§ Mount wafer-substrate with suitable laminator or with “vacuum bagging” equipment
§ Low ionic and ease of total removal with suitable solvent
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