The following tables are representative of products that have been engineered for:
· Microwave large and small area substrate attach
· Inline curing SMT adhesive with outstanding pot-life and dispensing properties
· Patented solder-replacement component attach conductive adhesives
Click on the Product for the TDS
|
AIT
Product
|
Characteristics
|
Electrical Resistivity
(ohm-cm)
|
Thermal Conductivity(watt/m-oC)
|
Die-shear (psi)
|
Tg (oC)
|
Viscosity/
Thixotropic Index
|
|
-Stress free
-One or two component -Large bonding areas |
>1x1014
|
>1.7
|
>1,800
|
-20
|
300,000
(cps@ 0.5 rpm) |
|
|
-Substrate attach
-Large bonding areas -Bonding mismatched CTE's |
>1x1014
|
>3.67
|
>1,800
|
-25
|
337,000
(cps@ 0.5 rpm) |
|
|
-Solvent free
-Stress free |
>1x1014
|
>1.7
|
>1,800
|
-25
|
276,000
(cps@ 0.5 rpm) |
|
|
-Solvent free
-Stress free |
>1x1014
|
>3.6
|
>1,800
|
-25
|
245,000
(cps@ 0.5 rpm) |
|
|
-Stress free
-Mismatched CTE's |
>1x1014
|
>1.7
|
>2,400
|
-25
|
144,000
(cps@ 0.5 rpm) |
|
|
-Stress free
-High power die attach |
>1x1014
|
>3.6
|
>1,800
|
-25
|
250,000
(cps@ 0.5 rpm) |
|
|
-Stress free
-Diamond filled |
>1x1014
|
>11.4
|
>1,800
|
-25
|
310,000
(cps@ 0.5 rpm) |
|
|
-Stress free
-Moisture resistant |
>1x1014
|
>3.6
|
>1,600
|
-55
|
20,000
(cps@ 5 rpm) |
|
|
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC -Automatic consistent dispensing |
>1x1014
|
>1.2
|
>3,000
|
60
|
10,000
(cps@ 0.5 rpm) TI >4.0
|
|
|
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC -Automatic consistent dispensing -Thermally conductive
|
>1x1014
|
>2.2
|
>1,500
|
-40
|
10,000
(cps@ 0.5 rpm) TI >4.0
|
|
|
-Stress free
-Fast curing |
>1x1014
|
>3.6
|
>1,200
|
-10
|
200,000
(cps@ 0.5 rpm) |
|
|
-Solvent free
-High Green Strength |
>1x1013
|
>2.9
|
>1,200
|
-60
|
60,000
(cps@ 5 rpm) |
|
AIT
Product
|
Characteristics
|
Electrical Resistivity
(ohm-cm)
|
Thermal Conductivity(watt/m-oC)
|
Die-shear
(psi) |
Tg (oC)
|
Viscosity
|
|
-Stress free
-One or two component -Large bonding areas |
<4x10-4 | >6.0 |
>1,800
|
-20
|
300,000
(cps@ 0.5 rpm) |
|
|
-Substrate attach
-Large bonding areas -Bonding mismatched CTE's |
<4x10-4 | >6.0 |
>1,800
|
-25
|
337,000
(cps@ 0.5 rpm) |
|
|
-Solvent free
-Stress free |
<4x10-4 | >6.0 |
>1,800
|
-25
|
276,000
(cps@ 0.5 rpm) |
|
|
-Solvent free
-Stress free |
<4x10-4 | >7.9 |
>1,000
|
-20
|
60,00
(cps@ 2.5 rpm) |
|
|
-Stress free
-Mismatched CTE's |
<4x10-4 | >7.9 |
>2,400
|
-25
|
144,000
(cps@ 0.5 rpm) |
|
|
-Solder replacement
-Rapid curing
-Molecularly flexible
-More than 7 days pot-life -Dispensible & screen printable |
<4x10-4 | >6.0 |
>1,500
|
-20
|
15,000
(cps@ 0.5 rpm) TI >4
|
|
|
-Stress free
-High power die attach |
<4x10-4 | >6.0 |
>1,800
|
-25
|
250,000
(cps@ 0.5 rpm) |
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