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AIT has many proven epoxy paste adhesives for thermal management in component and substrate attachment. The ME8456 series of flexible conductive adhesives have been the mainstay of conductive adhesives used for microwave applications in military electronics with 20 years of proven success. 

  

 

The following tables are representative of products that have been engineered for:

·      Microwave large and small area substrate attach

·      Inline curing SMT adhesive with outstanding pot-life and dispensing properties

·      Patented solder-replacement component attach conductive adhesives

 

Click on the Product for the TDS 

Non-conductive Substrate Attach Paste
 

AIT
Product
Characteristics
Electrical Resistivity
(ohm-cm)
Thermal Conductivity(watt/m-oC)
Die-shear (psi)
Tg (oC)
Viscosity/
Thixotropic Index
-Stress free
-One or two component
-Large bonding areas
>1x1014
>1.7
>1,800
-20
300,000
(cps@ 0.5 rpm)
-Substrate attach
-Large bonding areas
-Bonding mismatched CTE's
>1x1014
>3.67
>1,800
-25
337,000
(cps@ 0.5 rpm)
-Solvent free
-Stress free
>1x1014
>1.7
>1,800
-25
276,000
(cps@ 0.5 rpm)
-Solvent free
-Stress free
>1x1014
>3.6
>1,800
-25
245,000
(cps@ 0.5 rpm)
 -Stress free
-Mismatched CTE's
>1x1014
>1.7
>2,400
-25
144,000
(cps@ 0.5 rpm)
-Stress free
-High power die attach 
>1x1014
>3.6
>1,800
-25
250,000
(cps@ 0.5 rpm)
-Stress free
-Diamond filled 
>1x1014
>11.4
>1,800
-25
310,000
(cps@ 0.5 rpm)
-Stress free
-Moisture resistant
>1x1014
>3.6
>1,600
-55
20,000
(cps@ 5 rpm)
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
>1x1014
>1.2
>3,000
60
10,000
(cps@ 0.5 rpm)
TI >4.0
-1-component, 7 days pot-life min.
-Rapid inline curing @ 150-175oC
-Automatic consistent dispensing
-Thermally conductive
>1x1014
>2.2
>1,500
-40
10,000
(cps@ 0.5 rpm)
TI >4.0
-Stress free
-Fast curing
>1x1014
>3.6
>1,200
-10
200,000
(cps@ 0.5 rpm)
-Solvent free
-High Green Strength
>1x1013
>2.9
>1,200
-60
60,000
(cps@ 5 rpm)

 AIT offers many other Substrate Attach paste materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. 

 

Electrically Conductive Substrate Attach Paste
  

AIT
Product
Characteristics
Electrical Resistivity
(ohm-cm)
Thermal Conductivity(watt/m-oC)
Die-shear

(psi)
Tg (oC)
Viscosity
-Stress free
-One or two component
-Large bonding areas
 <4x10-4     >6.0
>1,800
-20
300,000
(cps@ 0.5 rpm)
-Substrate attach
-Large bonding areas
-Bonding mismatched CTE's
  <4x10-4    >6.0
>1,800
-25
337,000
(cps@ 0.5 rpm)
-Solvent free
-Stress free
  <4x10-4   >6.0 
>1,800
-25
276,000
(cps@ 0.5 rpm)
-Solvent free
-Stress free
 <4x10-4  >7.9 
>1,000
-20
60,00
(cps@ 2.5 rpm)
 -Stress free
-Mismatched CTE's
 <4x10-4    >7.9
>2,400
-25
144,000
(cps@ 0.5 rpm)
-Solder replacement
-Rapid curing
-Molecularly flexible
-More than 7 days pot-life
-Dispensible & screen printable
 <4x10-4  >6.0
>1,500
-20
15,000
(cps@ 0.5 rpm)
TI >4
-Stress free
-High power die attach 
 <4x10-4      >6.0
>1,800
-25
250,000
(cps@ 0.5 rpm)

 AIT offers many other Substrate Attach paste materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application. 

 

 

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