Component & Substrate Attach Paste Adhesives

AIT Substrate and Component Attach Paste Adhesives Designed for Stress-Free Large Area Bonding:

  • Stencil and screen printed epoxy
  • B-stageable epoxy adhesive
  • Cyanaesther based high temperature adhesives
  • Adhesives dispense and rapidly cure for surface mounting of components
  • Controlled thixotropic index for precise positioning of components
  • Rapid heat curing for high volume through-put manufacturing
  • High thermal conductive electrically insulating adhesive
  • Electrically conductive and thermally conductive adhesive

Computer Chip

Performance Characteristics:

  • Stress free bonding proven for robust applications
  • Provides for reliable and long-term stability with molecular flexibility
  • Non-silicone and non-contaminating

Circuit Board

Substrate and Component Attach Paste Adhesives are Designed for Stress-Free Large Area Bonding with Molecularly Engineered Polymer Structures

AIT has many proven epoxy paste adhesives for thermal management in component and substrate attachment. The ME8456 series of flexible conductive adhesives has been the mainstay of conductive adhesives used for microwave applications in military electronics with 20 years of proven success.

The following tables are representative of products that have been engineered for:

  • Microwave large and small area substrate attach
  • Inline curing SMT adhesive with outstanding pot-life and dispensing properties
  • Patented solder-replacement component attach conductive adhesives

Non-conductive Substrate Attach Paste

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C) Viscosity/ Thixotropic Index
EG7655
  • Stress free
  • One or two component
  • Large bonding areas
>1×1014 >1.7 >1,800 -20 300,000(cps@ 0.5 rpm)
EG7658
  • Substrate attach
  • Large bonding areas
  • Bonding mismatched CTE’s
>1×1014 >3.67 >1,800 -25 337,000(cps@ 0.5 rpm)
ME7155
  • Solvent free
  • Stress free
>1×1014 >1.7 >1,800 -25 276,000(cps@ 0.5 rpm)
ME7155-AN
  • Solvent free
  • Stress free
>1×1014 >3.6 >1,800 -25 245,000(cps@ 0.5 rpm)
ME7156
  • Stress free
  • Mismatched CTE’s
>1×1014 >1.7 >2,400 -25 144,000(cps@ 0.5 rpm)
ME7158
  • Stress free
  • High power die attach
>1×1014 >3.6 >1,800 -25 250,000(cps@ 0.5 rpm)
ME7159
  • Stress free
  • Diamond filled
>1×1014 >11.4 >1,800 -25 310,000(cps@ 0.5 rpm)
ME7556-DA
  • Stress free
  • Moisture resistant
>1×1014 >3.6 >1,600 -55 20,000(cps@ 5 rpm)
ME7630-RC
  • 1-component, 7 days pot-life min.
  • Rapid inline curing @ 150-175°C
  • Automatic consistent dispensing
>1×1014 >1.2 >3,000 60 10,000(cps@ 0.5 rpm) TI >4.0
ME7655-RC
  • 1-component, 7 days pot-life min.
  • Rapid inline curing @ 150-175°C-
  • Automatic consistent dispensing
  • Thermally conductive
>1×1014 >2.2 >1,500 -40 10,000(cps@ 0.5 rpm) TI >4.0
ME7656
  • Stress free
  • Fast curing
>1×1014 >3.6 >1,200 -10 200,000(cps@ 0.5 rpm)
ME7857-SC
  • Solvent free
  • High Green Strength
>1×1013 >2.9 >1,200 -60 60,000(cps@ 5 rpm)

New product:
ME7563 with modified zinc oxide crystallite filled for lowest thermal resistance

Electrically Conductive Substrate Attach Paste

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C) Viscosity
EG8050
  • Stress free
  • One or two component
  • Large bonding areas
<4×10-4 >6.0 >1,800 -20 300,000(cps@ 0.5 rpm)
ME8155
  • Substrate attach
  • Large bonding areas
  • Bonding mismatched CTE’s
<4×10-4 >6.0 >1,800 -25 337,000(cps@ 0.5 rpm)
ME8452-A
  • Solvent free
  • Stress free
<4×10-4 >6.0 >1,800 -25 276,000(cps@ 0.5 rpm)
ME8456-00
  • Solvent free
  • Stress free
<4×10-4 >12.5 >1,200 -20 60,00(cps@ 2.5 rpm)
ME8456-LV GS002
  • Stress free
  • Mismatched CTE’s
<4×10-4 >7.9 >2,400 -25 144,000(cps@ 0.5 rpm)
ME 8650-RC
  • Solder replacement
  • Rapid curing
  • Molecularly flexible-More than 7 days pot-life
  • Easily dispensed & screen printable
<4×10-4 >6.0 >1,500 -20 15,000(cps@ 0.5 rpm) TI >4
ME8850-DA
  • Stress free-High power die attach
<4×10-4 >6.0 >1,800 -25 250,000(cps@ 0.5 rpm)

New Product:
ME8560: silver filled, 100% solid without solvent or diluent, electrically conductive adhesive

For a recommendation, information or assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308