AIT Substrate and Component Attach Paste Adhesives Designed for Stress-Free Large Area Bonding:
- Stencil and screen printed epoxy
- B-stageable epoxy adhesive
- Cyanaesther based high temperature adhesives
- Dispensible and rapid curing adhesive for surface mounting of components
- Controled thixotropic index for precise positioning of components
- Rapid heat curing for the high volume through-put manufacturing
- High thermal conductive electrically insulating adhesive
- Electrically conductive and thermally conductive adhesive
Peformance Characteristics:
- Stress free bonding proven for robust applications
- Provide for reliable and long-term reliability with molecular flexibility
- Non-silicone and non-contaiminating
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Substrate and Component Attach Paste Adhesives that are Designed for Stress-Free Large Area Bonding with Molecularly Engineered Polymer Structures
AIT has many proven epoxy paste adhesives for thermal management in component and substrate attachment. The ME8456 series of flexible conductive adhesives have been the mainstay of conductive adhesives used for microwave applications in military electronics with 20 years of proven success.
The following tables are representative of products that have been engineered for:
- Microwave large and small area substrate attach
- Inline curing SMT adhesive with outstanding pot-life and dispensing properties
- Patented solder-replacement component attach conductive adhesives
Non-conductive Substrate Attach Paste
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity/ Thixotropic Index |
|---|---|---|---|---|---|---|
| EG7655 |
|
>1x1014 | >1.7 | >1,800 | -20 | 300,000(cps@ 0.5 rpm) |
| EG7658 |
|
>1x1014 | >3.67 | >1,800 | -25 | 337,000(cps@ 0.5 rpm) |
| ME7155 |
|
>1x1014 | >1.7 | >1,800 | -25 | 276,000(cps@ 0.5 rpm) |
| ME7155-AN |
|
>1x1014 | >3.6 | >1,800 | -25 | 245,000(cps@ 0.5 rpm) |
| ME7156 |
|
>1x1014 | >1.7 | >2,400 | -25 | 144,000(cps@ 0.5 rpm) |
| ME7158 |
|
>1x1014 | >3.6 | >1,800 | -25 | 250,000(cps@ 0.5 rpm) |
| ME7159 |
|
>1x1014 | >11.4 | >1,800 | -25 | 310,000(cps@ 0.5 rpm) |
| ME7556-DA |
|
>1x1014 | >3.6 | >1,600 | -55 | 20,000(cps@ 5 rpm) |
| ME7630-RC |
|
>1x1014 | >1.2 | >3,000 | 60 | 10,000(cps@ 0.5 rpm) TI >4.0 |
| ME7655-RC |
|
>1x1014 | >2.2 | >1,500 | -40 | 10,000(cps@ 0.5 rpm) TI >4.0 |
| ME7656 |
|
>1x1014 | >3.6 | >1,200 | -10 | 200,000(cps@ 0.5 rpm) |
| ME7857-SC |
|
>1x1013 | >2.9 | >1,200 | -60 | 60,000(cps@ 5 rpm) |
New product:
ME7563 with modified zinc oxide crystallite filled for lowest thermal resistance
Electrically Conductive Substrate Attach Paste
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity |
|---|---|---|---|---|---|---|
| EG8050 |
|
<4x10-4 | >6.0 | >1,800 | -20 | 300,000(cps@ 0.5 rpm) |
| ME8155 |
|
<4x10-4 | >6.0 | >1,800 | -25 | 337,000(cps@ 0.5 rpm) |
| ME8452-A |
|
<4x10-4 | >6.0 | >1,800 | -25 | 276,000(cps@ 0.5 rpm) |
| ME8456-00 |
|
<4x10-4 | >12.5 | >1,200 | -20 | 60,00(cps@ 2.5 rpm) |
| ME8456-LV GS002 |
|
<4x10-4 | >7.9 | >2,400 | -25 | 144,000(cps@ 0.5 rpm) |
| ME 8650-RC |
|
<4x10-4 | >6.0 | >1,500 | -20 | 15,000(cps@ 0.5 rpm) TI >4 |
| ME8850-DA |
|
<4x10-4 | >6.0 | >1,800 | -25 | 250,000(cps@ 0.5 rpm) |
New Product:
ME8560: silver filled, 100% solid without solvent or diluent, electrically conductive adhesive
AIT offers many other Substrate Attach paste materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.
