With more than 25 years of pioneering product development for stress free molecularly flexible adhesives made with epoxy and thermoplastic polymers, AIT has been one of the innovative substrate and large area bonding product lines for electronics applications. With one of the most extensive patented and proprietary line-up of adhesive products and a team of experienced engineers and scientists, AIT prize itself to provide detailed analysis of your applications to ensure the best solutions to ensure your product successes.
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Molecularly Flexible Substrate Bonding Adhesives with Stress Free Bonding of Substrates and Components of Different Thermal Expansion Coefficients (CTE) for Ultimate Reliability
AIT has many proven epoxy paste and film adhesives for thermal and microwave ground plane management in component and substrate attachments. The ME8456 series of flexible conductive adhesives and TC8750 flexible film adhesive have been the mainstay of conductive adhesives used for microwave applications in military electronics with 20 years of proven success.
The more recent development of pressure sensitive epoxy film adhesives including RTK7559-LB, RTK7553-LB and RTC8550 have better thermal performance with longer-ambient shelf-life.
Factors Affecting Adhesive Reliability
| Contributor | Adverse Factor | Favorable Factor |
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The following subsequent web pages are some representative products. For more details on paste or film adhesives and their applications, please go to the respective dedicated web pages.
