MIL-STD 883C METHOD 5011.4 QUALIFIED ADHESIVE PRODUCTS
Test Procedures: Mil-Std 883C Method 5011.4
Test Conditions: Per Specification
Tests Performed: 1989 to 1996
Acceptability: Both material characteristics and system level performances must meet requirements
(Click on the Product for the TDS.)
|
AIT Product |
Characteristics |
Electrical Resistivity |
Thermal |
Die-shear |
Tg (oC) |
|
Flexible
Ambient storage dry epoxy film |
>1x1014
|
>1.7
|
>2,000
|
-60
|
|
|
1-component flexible
epoxy paste |
>1x1014
|
>1.7
|
>1,000
|
-25
|
|
| 1-component flexible epoxy paste |
>1x1014
|
>1.7 | >1,000 | -25 | |
|
1-component flexible
epoxy paste Diamond filled |
>1x1014
|
>11.4
|
>1,000
|
-25
|
|
|
1-component rigid
epoxy paste |
<5x10-4
|
>7.9
|
>2,000
|
130
|
|
|
1-component flexible
epoxy paste |
<4x10-4
|
>7.9
|
>1,000
|
-20
|
|
|
1-component flexible
epoxy paste |
<5x10-4
|
>5.7
|
>1,800
|
-25
|
|
|
1-component flexible
epoxy paste |
<4x10-4 | >7.9 | -20 | ||
|
Tacky epoxy film
|
<5x10-4
|
>6.4
|
>2,400
|
-25
|
|
|
Dry thermoplastic film
|
<4x10-4
|
>6.4
|
>900
|
-70
|
|
|
Dry thermoplastic film
|
<4x10-4
|
>6.4
|
>900
|
-70
|
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