Solderable Lid Solution and Process
1. Send lid design to AIT sales-engineering staff
2. Review and approve lid design
3. Etched lid profiles in accordance to lid design
4. Place and cure lids with AIT preform adhesive on etched copper
5. Solder dip or reflow solder application on lids
6. Excised lids with cured perform adhesive
7. Place and solder lids
8. Test for seals and other qualities
Solderable Insulating Lids
AIT patent-pending solderable insulating lids and patented wafer level MEMS and optical lids solutions (US patent#6,432,253; 6,428,650; 6,409,859; 6,136,128) represents some of the most innovative solutions in hermetic lid sealing. The solderable lid sealing when applied to insulating lids such as glass for optical lids, ceramic lids for large and small components, LCP (Liquid Crystal Polymers) for high performance components, and lid seals for MEMS and wafer level packaging represents some of the most cost-effective solutions with unparalleled reliability performance:
◊ The only proven polymer lid-seal solution that passed fine and gross leak tests.
◊ Unparalleled high temperature stability to withstand soldering at 300°C.
◊ Ideal for high volume components lid sealing.
◊ Ideal for CCD and optical devices when glass lids are used.
|
AIT Product
|
Process & Characteristics
|
Copper Thickness
(oz) |
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer (Volt/mil) |
|
Opto-LidTM
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF
|
1 |
Pass |
>1000 |
|
AIT Product
|
Process & Characteristics
|
Copper Thickness
(oz) |
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer (Volt/mil) |
|
Ceramic-LidTM
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF
|
1 |
Pass |
>1000 |
|
AIT Product
|
Process & Characteristics
|
Copper Thickness
(oz) |
Gross Leak
&
Fine Leak
|
Dielectric
Strength of Insulating Layer (Volt/mil) |
|
LCP-LidTM
|
-Wafer or Panel of Devices
-B-staged high flow preforms
-Ease of Customization
-Withstand 300oC soldering
-AIT ESP 7675-HF
|
1 |
Pass |
>1000 |
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