Insulated Metal Substrate Copper Clads & Pre-Preg

AIT COOL-CLAD™ and COUPLER™ copper-clad laminated substrate and copper-clad pre-preg panels used for multi-layered insulated metal substrate circuits can be handled in exactly the same method and infrastructure as commonly used in standard PWBs and flex circuits.

1. Panel & Roll Copper-clad Material Handling

  • COOL-CLAD™ and COUPLER™ copper-clad laminate substrates can be stored in ambient conditions for at least 12 months.
  • COUPLER™ pre-preg can be stored in ambient conditions for at least 6 months.

2. Panel Prep

  • Tooling/Registration
  • Scrubbing
  • Chemical Cleaning
  • Base Metal Protection

3. Imaging

  • Dry Film Application
  • Wet Film Application
  • Screened Image Application

4. Wet Chemistry Processing

  • Etching
  • Stripping
  • Post Etch/Strip Clean

5. Solder Mask Application

  • Screen, Spray or Curtin Coat
  • Thermal Solder Mask
  • UV Cured Solder Mask

6. Second Step Drill or Punch

  • Punch
  • Drill

7. Finishing Operation

  • HASL
  • OSP
  • Tin
  • Ni/Au

8. Finishing Fabrication

  • Rout
  • Score
  • Punch

Power Module

Power modules and power supplies are some of the most suitable applications for the insulated thermal substrate

Causes of Electrical Failure

The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature. The use of insulated metal thermal substrate lowers the cost of products and enhances their long-term reliability.

Additional information on AIT COOL-CLAD™ Thermal Insulated Metal or Metal Core Printed Circuit Board (MCPCB) Laminate Substrates and Thermally Conductive Pre-Pregs are available in this brochure.

Insulated Metal Substrate Laminates for Metal Core Printed Circuit Boards (MCPCB) with Lowest Thermal Resistance and Internal Interfacial Stress for Large Area LED Displays, LED Lighting and High Power Modules

Light emitting diode (LED) lighting and LED display require high thermal dissipation performance, low cost LED substrate and long-term reliability. AIT insulated metal substrate laminate is ideal for these Metal Core Printed Circuit Board (MCPCB) applications and are available in high volume and fast delivery at costs that are among the lowest in the industry.

AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716) insulated metal substrates provide unparalleled thermal and reliability performance.  AIT insulated metal substrate differs from traditional Insulated Metal Substrate thermal circuit substrate in the following areas:

LED Light Module

  • LED substrates contain insulated metal for printed circuit boards.
  • Instead of a thermally conductive rigid fiberglass epoxy laminate, AIT uses a proprietary flexible thermal dielectric insulating layer resulting in stress and warp-free thermal copper-clad laminates with proven low thermal resistance.
  • Unparalleled thermal conductivity in the insulating layer by eliminating fiberglass fabrics.
  • High temperature stability to withstand soldering at 300°C.
  • Multi-layer capability with the same flexible dielectric copper-clad pre-preg that can be laminated at less than 14 psi pressure and at 125°C or higher.
  • Base metal plates with choice of aluminum and copper from 35 mils to 350 mils.
  • Thinner insulated metal substrate and pre-preg are available in rolls of 12-inch width.
  • Thicker insulated metal substrate and pre-preg are available in sheets of 12-inch by 24-inch.
  • Ideal for power and LED components and modules.

Insulated Metal Thermal Substrate

AIT insulated metal substrate laminates for Metal Core Printed Circuit Board (MCPCB) have the lowest proven thermal resistance among this class of thermal substrate laminates. AIT’s thermally conductive laminates are available with 1, 2 or 4 oz copper on 40 or 60 mil aluminum plate panels of 20-inch by 24 inch and a dielectric layer of 75 micron. AIT IMTS offers unparalleled advantages, such as having two times more thermal conductivity and zero internal stress for long-term reliability.

Insulated Metal Thermal Substrate Heat Sink

An additional heatsink fin can be easily attached to the power devices made with insulated metal thermal substrate. AIT thermal conductive adhesives are known for their low thermal resistance and ease of use as a thermally conductive adhesive paste or film.

Insulated Metal Thermal Substrate
Single-Sided Insulated Metal (Metal Core Printed Circuit Board, MCPCB) Substrate for Power & LED Modules.

Typical Dielectric Properties of Cool-Clad™ CXP Series for High Performance MCPCB:

PROPERTY/PARAMETER VALUE
Electrical Resistivity of Dielectric Layer >10¹⁴ ohm-cm
Dielectric Strength of Dielectric Layer @ 25 Micron Thickness (Volts/mil) >1000 V/mil
Glass Transition Temp. of Dielectric Layer (°C) 200
Peel Strength  o Dielectric Layer (Pound/inch) >6
Device Push-off Strength of Dielectric Layer (psi) >2000
Hardness of Dielectric Layer (Type) > 95 (D)
Cured Density of Dielectric Layer (gm/cc) 2.5
Thermal Conductivity of Dielectric Layer 3 W/m-°C
Linear Thermal Expansion Coefficient of Laminate (ppm/°C) 19
Maximum Continuous Operation Temp. (°C) 250

Typical Dielectric Properties of Cool-Clad™ ESP Series for Flexible Circuits MCPWB:

PROPERTY/PARAMETER VALUE
Electrical Resistivity of Dielectric Layer >10¹⁴ ohm-cm
Dielectric Strength of Dielectric Layer @ 75 Micron Thickness (Volts/mil) >1000 V/mil
Glass Transition Temp. of Dielectric Layer (°C) -55
Peel Strength (Pound/inch) >3
Device Push-off Strength of Adhesive Layer (psi) >1500
Hardness of Adhesive Layer (Type) > 80 (A)
Cured Density of Dielectric of Adhesive Layer (gm/cc) 2.5
Thermal Conductivity of Adhesive Layer 3 W/m-°C
Linear Thermal Expansion Coefficient of Laminate (ppm/°C) 19
Maximum Continuous Operation Temp. (°C) > 180
AIT Product Characteristics Copper Thickness(oz) Thermal Resistance(°C/W-in2) Nominal Stack Thickness (mils) Dielectric Strength of Insulating Layer(Volt/mil) Dielectric Constant of Insulating Layer
COOL-CLAD™ CXP CC-AL-SS-1
  • Stress absorbing thermal dielectric
  • Aluminum Clad
  • Ease of Machining
  • Withstands 300°C soldering
1 <1.5 65/66 >1000 4.5
COOL-CLAD™ CXP CC-AL-SS-2
  • Stress absorbing thermal dielectric
  • Aluminum Clad
  • Ease of Machining
  • Withstands 300°C soldering
2 <1.5 67/68 >1000 4.5
COOL-CLAD™ (CXP or ESP) CC-AL-SS-3
  • Stress absorbing thermal dielectric
  • Aluminum Clad
  • Ease of Machining
  • Withstands 300°C soldering
3 <1.5 68/69 >1000 4.5
COOL-CLAD™ CXP CC-AL-SS-4
  • Flexible thermal dielectric
  • Aluminum Clad
  • Ease of Machining
  • Withstands 300°C soldering
4 <1.5 70/71 >1000 4.5
COOL-CLAD™ CXP CC-AL-SS-5
  • Stress absorbing thermal dielectric
  • Aluminum Clad
  • Ease of Machining
  • Withstands 300°C soldering
5 <1.5 72/73 >3000 4.5
COOL-CLAD™ CXP CC-AL-SS-6
  • Stress absorbing thermal dielectric
  • Aluminum Clad
  • Ease of Machining
  • Withstands 300°C soldering
6 <1.5 73/74 >3000 4.5

Double-Sided Copper-Clad Laminates (Metal Core Printed Wiring Board) for Power & LED Modules

AIT Product Characteristics Copper Thickness(oz) Thermal Resistance( °C/W-in2) Nominal Stack Thickness (mils) Dielectric Strength of Insulating Layer(Volt/mil) Dielectric Constant of Insulating Layer
COOL-CLAD™ CXP CC-CU-DS-1
  • Stress absorbing thermal dielectric
  • Copper-clad Base Plate (60 mil)
  • Ease of Machining
  • Withstand 300°C soldering
1 <1.1 65/66 >1000 4.5
COOL-CLAD™ CXP C-CU-DS-2
  • Stress absorbing Thermal dielectric
  • Copper-clad Base Plate (60 mil)
  • Ease of Machining
  • Withstand 300°C soldering
2 <1.1 67/68 >1000 4.5
COOL-CLAD™ CXP CU-DS-3
  • Flexible thermal dielectric
  • Copper-clad Base Plate (60 mil)
  • Ease of Machining
  • Withstand 300°C soldering
3 <1.1 69/70 >1000 4.5
COOL-CLAD™ CXP CC-CU-DS-X
  • Stress absorbing thermal dielectric
  • Copper-clad Base Plate (60 mil)
  • Ease of Machining
  • Withstand 300°C soldering
Custom <1.1 Custom >1000 4.5
COOL-CLAD™ CXP CC-CU-OX-DS-X
  • Stress absorbing thermal dielectric
  • Copper-clad Base Plate (60 mil)
  • Ease of Machining
  • Withstand 300°C soldering
Custom <1.1 Custom >3000 3.9

Flexible Thermal Copper-clad Pre-preg for Power & LED Modules

AIT Product Characteristics Copper Thickness(oz) Thermal Resistance(°C/W-in2) Nominal Stack Thickness (mils) Dielectric Strength of Insulating Layer(Volt/mil) Dielectric Constant of Insulating Layer
COOL-CLAD™ ESP CU-1
  • Flexible thermal dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
1 <1.1 5/6 >1000 4.5
COOL-CLAD™ ESP CU-2
  • Flexible thermal dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
2 <1.1 7/8 >1000 4.5
COOL-CLAD™ ESP CU-X
  • Flexible thermal dielectric
  • Lamination Flow @>125°C and <14 psi
  • Withstands 300°C soldering
Custom <1.1 Custom >1000 4.5

Typical Multi-Layer Processing Parameters for Cool-Clad™:

PRE-PREG PROCESSING  FOR COOL-CLAD CXP CXP7685-PP
Storage and Shelf Life Ambient in original package
Lamination Temperature, Pressure and Time 150-175°C/10-15 psi/>30 second
Post Curing (Without Pressure) Same temperature as lamination
PRE-PREG PROCESSING  FOR COOL-CLAD ESP ESP7455-PP
Storage and Shelf Life Ambient in original package
Lamination Temperature, Pressure and Time 150-175°C/10-15 psi/>30 second
Post Curing (Without Pressure) Same temperature as lamination

OTHER RELATED TECHNOLOGIES FROM AI TECHNOLOGY

Solderable Flexible Circuit Copper Clad Laminate (COUPLER-C):

Characteristics Unit Conditioning Typical Values Specification
Volume Resistivity Mohm-cm C-96/35/90 5X107~5X108 106
Surface Resistivity Mohm C-96/35/90 5X105~5X106 105
Permittivity 1 MHz C-24/23/50 3.9-4.5 5.4
Loss Tangent 1 MHz C-24/23/50 0/013-0.020 0.035
Arc Resistance Sec D-48/50 + D-0.5/23 100 60
Dielectric Breakdown KV D-48/50 45 40
Moisture Absorption % D-24/23 0.01-0.20 0.35
Flammability C-24/23/50+E-24/125 94V0 94V0
Peel Strength 1oz Lb/in 288°C Solder Floating 8 8
Thermal Stress Sec 288°C Solder Dipping 600 300

For a recommendation, information or assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308