AIT COOL-CLAD™ and COUPLER™ copper-clad laminate substrate and copper-clad pre-preg panels used for multi-layered insulated metal substrate circuits can be handled in exactly the same method and infrastructure as commonly used in standard PWB and flex circuit.
1. Panel & Roll Copper-clad Material Handling
- COOL-CLAD™ and COUPLER™ copper-clad laminate substrates can be stored in ambient conditions for at least 12 months.
- COUPLER™ pre-preg can be stored in ambient conditions for at least 6 months.
2. Panel Prep
- Tooling/Registration
- Scrubbing
- Chemical Cleaning
- Base Metal Protection
3. Imaging
- Dry Film Application
- Wet Film Application
- Screened Image Application
4. Wet Chemistry Processing
- Etching
- Stripping
- Post Etch/Strip Clean
5. Solder Mask Application
- Screen, Spray or Curtin Coat
- Thermal Solder Mask
- UV Cured Solder Mask
6. Second Step Drill or Punch
- Punch
- Drill
7. Finishing Operation
- HASL
- OSP
- Tin
- Ni/Au
8. Finishing Fabrication
- Rout
- Score
- Punch
Power modules and power supplies are some of the most suitable applications for the insulated thermal substrate
The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature. The use of insulated metal thermal substrate lower the cost of products and enhance the long-term reliability.
Additional information on AIT COOL-CLAD™ Thermal Insulated Metal or Metal Core Printed Circuit Board (MCPCB) Laminate Substrates and Thermally Conductive Pre-Pregs are available in this brochure.
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Insulated Metal Substrate Lamiantes for Metal Core Printed Circuit Board (MCPCB) with Lowest Thermal Resistance and Internal Interfacial Stress for Large Area LED Displays, LED Lighting and High Power Modules
AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716) applied to insulated metal substrates differs from traditional Insulated Metal Substrate thermal circuit substrate in the following aspects to give them the unparalleled thermal and reliability performance:
Light emitting diode (LED) lighting and LED display are some of the stringent requirements that need high thermal dissipation performance, low cost LED substrate with long-term reliability. AIT insulated metal substrate laminate is ideal for these Metal Core Printed Circuit Boards (MCPCB) applications and are available in high volume and fast delivery at cost that are among the lowest in the industry.
- LED substrates with insulated metal for printed circuit boards
- Instead of a thermally conductive rigid fiberglass epoxy laminate, we use our proprietary flexible thermal dielectric insulating layer resulting in stress and warp-free thermal copper-clad laminates with proven low thermal resistance.
- Unparalleled thermal conductivity in the insulating layer by eliminating the fiberglass fabrics.
- High temperature stability to withstand soldering at 300°C.
- Multi-layer capability with the same flexible dielectric copper-clad pre-preg that can be laminated at less than 14 psi pressure and at 125°C or higher.
- Base metal plates with choices of aluminum and copper from 35 mils to 350 mils.
- Thinner insulated metal substrate and pre-preg are available in rolls of 12-inch width.
- Thicker insulated metal substrate and pre-preg are available in sheets of 12-inch by 24-inch.
- Ideal for power and LED components, modules.
AIT insulated metal substrate lamiantes for Metal Core Printed Circuit Board (MCPCB) have proven lowest thermal resistance among this class of thermal substrate laminates. These thermally conductive laminates are available with 1, 2, 4 oz copper on 40 or 60 mil aluminum plate with panel of 20-inch by 24 inch and dielectric layer of 75 micron. AIT IMTS has unparalleled advantages of having two times more thermal conductivity and zero internal stress for long-term reliability.
Additional heatsink fin is easily attached to the power devices made with insulated metal thermal substrate. AIT thermal conductive adhesives are known for its low thermal resistance and ease of use in the form or either thermally conductive adhesive pastes or films.
Single-Sided Insulated Metal (Metal Core Printed Circuit Board, MCPCB) Substrate for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness(oz) | ThermalResistance(°C/W-in2) | Nominal Stack Thickness (mils) | DielectricStrength of Insulating Layer(Volt/mil) | Dielectric Constant of Insulating Layer |
|---|---|---|---|---|---|---|
| COOL-CLAD™ CC-AL-SS-1 |
|
1 | <1.5 | 65/66 | >1000 | 4.5 |
| COOL-CLAD™ CC-AL-SS-2 |
|
2 | <1.5 | 67/68 | >1000 | 4.5 |
| COOL-CLAD™ CC-AL-SS-3 |
|
3 | <1.5 | 68/69 | >1000 | 4.5 |
| COOL-CLAD™ CC-AL-SS-4 |
|
4 | <1.5 | 70/71 | >1000 | 4.5 |
| COOL-CLAD™ CC-AL-SS-5 |
|
5 | <1.5 | 72/73 | >3000 | 4.5 |
| COOL-CLAD™ CC-AL-SS-6 |
|
6 | <1.5 | 73/74 | >3000 | 4.5 |
Double-Sided Copper-Clad Laminates (Metal Core Printed Wiring Board) for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness(oz) | ThermalResistance( °C/W-in2) | Nominal Stack Thickness (mils) | DielectricStrength of Insulating Layer(Volt/mil) | Dielectric Constant of Insulating Layer |
|---|---|---|---|---|---|---|
| COOL-CLAD™ CC-CU-DS-1 |
|
1 | <1.1 | 65/66 | >1000 | 4.5 |
| COOL-CLAD™ CC-CU-DS-2 |
|
2 | <1.1 | 67/68 | >1000 | 4.5 |
| COOL-CLAD™ CC-CU-DS-3 |
|
3 | <1.1 | 69/70 | >1000 | 4.5 |
| COOL-CLAD™ CC-CU-DS-X |
|
Custom | <1.1 | Custom | >1000 | 4.5 |
| COOL-CLAD™ CC-CU-OX-DS-X |
|
Custom | <1.1 | Custom | >3000 | 3.9 |
Flexible Thermal Copper-clad Pre-preg for Power & LED Modules
| AIT Product | Characteristics | Copper Thickness(oz) | ThermalResistance(°C/W-in2) | Nominal Stack Thickness (mils) | DielectricStrength of Insulating Layer(Volt/mil) | Dielectric Constant of Insulating Layer |
|---|---|---|---|---|---|---|
| COOL-CLAD™ TPR-CU-1 |
|
1 | <1.1 | 5/6 | >1000 | 4.5 |
| COOL-CLAD™ TPR-CU-2 |
|
2 | <1.1 | 7/8 | >1000 | 4.5 |
| COOL-CLAD™ TPR-CU-X |
|
Custom | <1.1 | Custom | >1000 | 4.5 |
Solderable Flexible Circuit Copper Clad Laminate (COUPLER-C)
| Characteristics | Unit | Conditioning | Typical Values | Specification |
|---|---|---|---|---|
| Volume Resistivity | Mohm-cm | C-96/35/90 | 5X107~5X108 | 106 |
| Surface Resistivity | Mohm | C-96/35/90 | 5X105~5X106 | 105 |
| Permittivity 1 MHz | - | C-24/23/50 | 3.9-4.5 | 5.4 |
| Loss Tangent 1 MHz | - | C-24/23/50 | 0/013-0.020 | 0.035 |
| Arc Resistance | Sec | D-48/50 + D-0.5/23 | 100 | 60 |
| Dielectric Breakdown | KV | D-48/50 | 45 | 40 |
| Moisture Absorption | % | D-24/23 | 0.01-0.20 | 0.35 |
| Flammability | - | C-24/23/50+E-24/125 | 94V0 | 94V0 |
| Peel Strength 1oz | Lb/in | 288°C Solder Floating | 8 | 8 |
| Thermal Stress | Sec | 288°C Solder Dipping | 600 | 300 |
