Solderable Flexible 1 and 2-Sided Copper Laminates

Solderable Flexible 1 and 2-Sided Copper Laminate Flexible Circuit Substrate Materials

AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716) molecularly flexible dielectric laminate with copper (COUPLER™) as flexible circuit material differs from traditional polyimide copper laminates for flexible circuit applications in two fundamental aspects to give them the unparalleled reliability performance with cost effectiveness:

  • Instead of high Tg polyimide or liquid crystal polymer (LCP) substrate materials that requires either the use of acrylic
    adhesives or costly evaporated metal deposition, its uses AIT proprietary molecularly flexible dielectric to produce stress-free
    and solderable flexible substrate material for flexible circuits and component interposers.
  • Unparalleled high temperature stability to withstand soldering at 300°C when used as flexible circuit material.
  • Multi-layer capability with the same flexible dielectric copper clad pre-preg flexible circuit material that can be laminated at low pressure of less than 14 psi and 125°C or higher.
  • Thinner COUPLER™ flexible circuit substrate and pre-preg flexible circuit material are available in rolls of 24-inch width.
  • Thicker COUPLER™ flexible circuit substrate and flexible circuit pre-preg material are available in sheets of 24-inch by 24-inch.
  • Ideal for higher costs polyimide-copper laminate flexible circuit material replacement with increase in circuit speed and reliability.

Single-Sided Copper-Clad Laminate Flexible Circuit Material Substrates

AIT Product Characteristics Copper Thickness(oz) Thermal Resistance(°C/W-in2) Nominal Stack Thickness (mils) DielectricStrength of Insulating Layer(Volt/mil) Dielectric Constant of Insulating Layer
COUPLER™ CC-CU-SS-1.00
  • Flexible Dielectric
  • Copper Laminate
  • Ease of Machining
  • Withstands 300°C soldering
1.0 <1.5 88 >1000 3.1
COUPLER™ CC-CU-SS-0.50
  • Flexible Dielectric
  • Copper Laminate
  • Ease of Machining
  • Withstands 300°C soldering
0.5 <1.5 75 >1000 3.1
COUPLER™ CC-CU-SS-0.25
  • Flexible Dielectric
  • Copper Laminate
  • Ease of Machining
  • Withstands 300°C soldering
0.25 <1.5 60 >1000 3.1
COUPLER™ CC-CU-SS-X
  • Flexible Dielectric
  • Copper Laminate
  • Ease of Machining
  • Withstands 300°C soldering
Custom <1.5 Custom >1000 3.1

 

Double-Sided Copper Laminates Flexible Circuit Mateirals for Flexible Circuits, Interposers, and Modules

AIT Product Characteristics Copper Thickness(oz) Thermal Resistance(°C/W-in2) Nominal Stack Thickness (mils) DielectricStrength of Insulating Layer(Volt/mil) Dielectric Constant of Insulating Layer
COUPLER™ CC-CU-DS- (0.25/0.25)
  • Flexible thermal dielectric
  • Copper Base Plate
  • Ease of Machining
  • Withstands 300°C soldering
0.25/0.25 <1.1 66 >1000 3.1
COUPLER™ CC-CU-DS- (0.50/0.50)
  • Flexible thermal dielectric
  • Copper Base Plate
  • Ease of Machining
  • Withstands 300°C soldering
0.50/0.50 <1.1 88 >1000 3.1
COUPLER™ CC-CU-DS- (1.0/1.0)
  • Flexible thermal dielectric
  • Copper Base Plate
  • Ease of Machining
  • Withstands 300°C soldering
1.0/1.0 <1.1 125 >1000 3.1
COUPLER™ CC-CU-DS- (1.0/X)
  • Flexible thermal dielectric
  • Copper Base Plate
  • Ease of Machining
  • Withstands 300°C soldering
Custom <1.1 Custom >1000 3.1

For more information and recommendation assistance, please contact AIT sales and engineering:

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AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308