AI Technology, Inc.

Solderable Flexible 1 and 2-Sided Copper Laminate Flexible Circuit Substrate Materials

AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716) molecularly flexible dielectric laminate with copper (COUPLER^TM) as flexible circuit material differs from traditional polyimide copper laminates for flexible circuit applications in two fundamental aspects to give them the unparalleled reliability performance with cost effectiveness:

◊ Instead of high Tg polyimide or liquid crystal polymer (LCP) substrate materials that requires either the use of acrylic

adhesives or costly evaporated metal deposition, its uses AIT proprietary molecularly flexible dielectric to produce stress-free

and solderable flexible substrate material for flexible circuits and component interposers.

◊ Unparalleled high temperature stability to withstand soldering at 300°C when used as flexible circuit material.

◊ Multi-layer capability with the same flexible dielectric copper clad pre-preg flexible circuit material that can be laminated at low pressure of less than 14 psi and 125°C or higher.

◊ Thinner COUPLER^TM flexible circuit substrate and pre-preg flexible circuit material are available in rolls of 24-inch width.

◊ Thicker COUPLER^TM flexible circuit substrate and flexible circuit pre-preg material are available in sheets of 24-inch by 24-inch.

◊ Ideal for higher costs polyimide-copper laminate flexible circuit material replacement with increase in circuit speed and reliability.

FLEXIBLE CIRCUIT SUBSTRATE Material COMPARATIVE ANALYSIS
Property	Polyimide (PI)	LCP	PET	COUPLER™-C (PET & PI Replacement)	COUPLER™-CPI (PI-Adhesive Replacement)
Tensile Strength (kpsi)	40-50	15	30	5	50
Elongation (%)	40-60	16	50	200	60
Young’s Modulus (kpsi)	800	700	500	Elastomeric (20)	800
Tear Strength (gm)	18-26	15	>20	Elastomeric (5)	26
Peel Strength (lb/in)	3-4		8	8	8
Heat Shrinkage (@200°C, %)	0.04-0.08	0.04	“Melted”	Average <0.1 Elastomeric	0.04
CTE (ppm/°C)	13-14	18	60	Elastomeric	15
Moisture Absorption (%)	1.0-2.4	0.1	0.5	0.2	0.2 on circuit side
Dielectric Constant	3.1-3.3	3.0	3.3	3.0	3.0 on circuit side
Dielectric Loss	0.005	0.003	0.01	0.01	0.01 on circuit side
Dielectric Strength (kV/mil)	5.7-6.0	5.9	0.8	0.8	6.0 (overall)
Thermal Stress and Solderability	>600 sec @ 288°C	Marginal	NA	>600 sec @ 288°C	>600 sec @ 288°C
Thermal Stress and Solderability	>600 sec @ 300°C	NA	NA	>600 sec @ 300°C	>600 sec @ 300°C
Subtractive and Additive Process Applicability	Yes	Yes	NA	Yes	Yes
Additional Notes: 1. Some data is extracted from Advanced Packaging March 2002 2. Polyimide (PI) and LCP substrates are seeded and plated-up with copper layer. PI with acrylic adhesive has lower performance. 3. Data for Polyester (PET) are typical values. Since PET substrate is not solderable, it can only be used for Polymer Thick Film applications only. 4. COUPLER™-C is a laminate of standard electronic copper film with COUPLER™ substrate without adhesive. 5. COUPER™-CPI is a laminate of standard electronic copper film with COUPLER™ substrate on Polyimide core. 6. Typical thickness for COUPLER-C and COUPLER™-CPI are 3-mil COUPLER™ substrate and 2-mil COUPLER™ substrate on 1 mil PI. 7. COUPLER™-C and COUPLER™-CPI are available with either single side or both side copper films (@1/4, 1/2 oz or 1 oz, other thickness is available on special order). 8. “PRE-PREG” COUPLER™-CPI is available for multi-layer applications.

Single-Sided Copper-Clad Laminate Flexible Circuit Material Substrates

AIT Product	Characteristics	Copper Thickness (oz)	Thermal Resistance(^oC/W-in²)	Nominal Stack Thickness (mils)	Dielectric Strength of Insulating Layer (Volt/mil)	Dielectric Constant of Insulating Layer
COUPLER^TM CC-CU-SS-1.00	-Flexible Dielectric -Copper Laminate -Ease of Machining -Withstand 300^oC soldering	1.0	<1.5	88	>1000	3.1
COUPLER^TM CC-CU-SS-0.50	-Flexible Dielectric -Copper Laminate -Ease of Machining -Withstand 300^oC soldering	0.5	<1.5	75	>1000	3.1
COUPLER^TM CC-CU-SS-0.25	-Flexible Dielectric -Copper Laminate -Ease of Machining -Withstand 300^oC soldering	0.25	<1.5	60	>1000	3.1
COUPLER^TM CC-CU-SS-X	-Flexible Dielectric -Copper Laminate -Ease of Machining -Withstand 300^oC soldering	Custom	<1.5	Custom	>1000	3.1

Double-Sided Copper Laminates Flexible Circuit Mateirals for Flexible Circuits, Interposers,

and Modules

AIT Produt	Characteristics	Copper Thickness (oz)	Thermal Resistance(^oC/W-in²)	Nominal Stack Thickness (mils)	Dielectric Strength of Insulating Layer (Volt/mil)	Dielectric Constant of Insulating Layer
COUPLER^TM CC-CU-DS- (0.25/0.25)	-Flexible thermal dielectric -Copper Base Plate -Ease of Machining -Withstand 300^oC soldering	0.25/0.25	<1.1	66	>1000	3.1
COUPLER^TM CC-CU-DS- (0.50/0.50)	-Flexible thermal dielectric -Copper Base Plate -Ease of Machining -Withstand 300^oC soldering	0.50/0.50	<1.1	88	>1000	3.1
COUPLER^TM CC-CU-DS- (1.0/1.0)	-Flexible thermal dielectric -Copper Base Plate -Ease of Machining -Withstand 300^oC soldering	1.0/1.0	<1.1	125	>1000	3.1
COUPLER^TM CC-CU-DS- (1.0/X)	-Flexible thermal dielectric -Copper Base Plate -Ease of Machining -Withstand 300^oC soldering	Custom	<1.1	Custom	>1000	3.1

Flexible Pre-Preg Flexible Circuit Material for Multi-layer Flexible Circuits and Interposers

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AIT Product

Characteristics

Copper Thickness
(oz)

Nominal Stack Thickness

(mils)

Dielectric
Strength of Insulating Layer
(Volt/mil)

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