Melt-Bonding Lid-Shield

EMI Lids

Circuit Board with Regions of Shielding

Inserted Lid

Pre-Applied Melt-Bonding & Pressure-Sensitive EMI/RFI Shielding Lid-Shield For UHF and Microwave Components and Boards

With the use of LEAD-FREE soldering, having to reach 250-300°C for the attachment and rework of shielding lids on components could potential damages sensitive components on the boards. AIT has designed a series of EMI/RFI shielding solutions incorporating direct attach EMI shielding, cans, covers, lids and caps. The following are some of the potential benefits of these patented products and applications:

  • Allow inspection of finished products before attaching EMI/RFI cans and covers.
  • Attachment either by mechanical insertion or instant melt-flow at 150°C.
  • Flexibility of fully automated assembly or manual assembly.
  • Optional complete shield without ventilation holes with compressible phase change thermal enhancement.
  • Cost effective.

EMI Shielding Caps & Lids Solution and Process

1. Send lid design to AIT sales-engineering staff

  • AIT can work with your parts that are either dropped shipped to AIT for adding shielding adhesive
  • AIT can also produce the cans, caps or lids based on drawing for full-service solution

2. Review and approve lid or cap and adhesive coating design

3. AIT manufactures or used customer parts and coat adhesive preforms based on requirement.

4. AIT delivers lids or caps with adhesives on and ready for insertion on circuit board.

5. Place or insert lids with adhesive preforms onto board.

6. Reflow adhesive to form EMI shields onto devices

  • Induce and observe flow of adhesive to lid perimeters
  • AIT preforms are self-sealing with high flow to allow easy observation of sealing of all sides

7. Test for shielding and other qualities

8. Rework if necessary

EMI Metal Caps and Lids

AIT Product Process & Characteristics Minimum Lid Width (mils) Bond Strength (psi) Electrical Resistivity(ohm-cm)
CB 8250-E (Self-tacking, Insitu-curable)
  • Suitable for flat mating area of 250 micron or wider
  • Low cost pre-applied on your parts or your design
  • Insitu curing after bonding for bond strength at high temp
  • Ambient storable for 12 months min
3 >600 5×10-4
CB 8130 (Instant Melt-Bonding @130°C)
  • Suitable for contour and flat area of 250 micron or wider
  • Low cost pre-applied on your parts or your design
  • Low melt-bonding and rework temperature @ 130°C
  • Ambient storable for 12 months min
3 >600 5×10-4
CB 8133 (Instant Melt-Bonding @130°C)
  • Suitable for contour and flat area of 250 micron or wider
  • Low cost pre-applied on your parts or your design
  • Maintain bonding up to @ 130°C
  • Ambient storable for 12 months min
3 >600 5×10-3
EMI Covers, Lids & Caps
  • Your design with or without ventilation holes
  • Your parts or AIT provides parts with adhesives
  • All AIT provided parts are made with copper lamiante
  • All AIT EMI/RFI covers are internally electrically insulated
  • Optional thermal interface from components to cover
  • Ambient storable for 12 months min
  • Choose mechanical insertion or melt-attach @ 150°C
3 >600 Copper

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308