Compressible Gasket Sheets

EMI Lids

Circuit Board with Regions of Shielding

Inserted Lid

EMI/RFI/EMP Shielding Solutions

SHEET GASKET: Specialty Conductive Gasket

AIT Product Characteristics Electrical Resistivity(ohm-cm) Peel Strength(ppi) Thickness(mil/mm)
SPG 8006 (Pressure Sensitive) Conductive pressure sensitive sheet that can be die-cut into any shape gasket to provide >120dB shielding against EMI/RFI . Extremely conformable. <5×10-2 >3.0 ppi 20/ 0.540/ 1.0
SPG 8056 (Dry & Conformable) Conductive sheet (conductive coating on insulating silicone core) that can be die-cut into any shape gasket to provide >120dB shielding against EMI/RFI . Available with one side conductive pressure-sensitive adhesive. <5×10-2 NA 20/ 0.540/ 1.0
SPG 8055 (Dry & Conformable) Conductive sheet (conductive coating on insulating silicone core) that can be die-cut into any shape gasket to provide >120dB shielding against EMI/RFI . Available with one side conductive pressure-sensitive adhesive. <5×10-4 NA 20/ 0.540/ 1.0

“SHEET-COATING™ “: Ease of Application in Pre-Cut Preform

AIT Product Characteristics Electrical Resistivity(ohm-cm) Bond Strength Storage Life
SPC8015 (Pressure Sensitive, In-situ curable)
  • Withstand leadfree soldering temperature of over 300°C and maintain high flexibility
  • Low weight, low thickness of 20 micron laminate with conductive adhesive over insulating dielectric for ease of application
  • In-situ curing after instant pressure sensitive bonding of over 100 psi for bond strength at high temperature
<5×10-4 >600 psi 12 Months min.
SPC8075 (Instant Melt-Bonding)
  • Flexible conductive shielding laminate with conductive PSA adhesive over dielectric layer with thickness of 20 micron
  • Pressure sensitive for instant bonding that is curable to over 1000 psi bonding
  • Withstands soldering and high temperature operations of up to 300°C
<5×10-4 >600 psi 12 Months min.

COMPONENT-MODULE EMI/RFI SHIELDING: Covers & Lids with Pre-Applied Conductive Preform

AIT Product Characteristics Electrical Resistivity(ohm-cm) Bond Strength Storage Life
CB 8250-E (Pressure Sensitive, In-situ curable)
  • Suitable for flat mating area of 250 micron or wider.
  • Low cost pre-applied on your parts or your design.
  • In-situ curing after bonding for bond strength at high temperature.
5×10-4 >600 psi 12 Months min.
CB 8130 (Instant Melt-Bonding)
  • Suitable for contour and flat area of 250 micron or wider.
  • Low cost pre-applied on your parts or your design.
  • Low melt-bonding and rework temperature @ 130°C
5×10-4 >600 psi 12 Months min.

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT Solve My Problem

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308