To achieve the highest level of ease in component soldering operations without pre-baking, AIT die-attach pastes have been engineered with a molecular structure of low moisture absorption. This low moisture absorption is reflected in the consistent bond strength under extreme moisture exposure.

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With the increased usage of lead-free soldering, high temperature stability is critical. Low weight loss is engineered in AIT die-attach paste adhesives using a stable molecular structure. The following weight loss measure is a good indicator of the ability of AIT die-attach pastes to withstand higher temperature soldering operations and long-term high temperature applications.

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To enhance the productivity of die-attach operations, AIT die-attach pastes for high volume applications have been designed with 100% solids without diluent or solvent. The use of fast curing agents enables the adhesive to cure rapidly. AIT die-attach pastes are ideal for in-line curing manufacturing without additional post curing.

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AIT also designed a die-attach paste with long pot-life for high volume applications to ensure success in manufacturing operations.

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For more information, recommendations and assistance, please contact AIT sales and engineering:

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AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308

Reliable Die Attach Adhesive And Underfill For Large And Small Dies In Flip Chip Packaging, Stack Chip Packaging And Through Silicon Via Filling

AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing. Some of the following representative products have a demonstrated record of more than 20 years of reliability for military and aerospace applications.

New adhesive underfill and stress relief material innovations for advanced stack chip packaging, flip chip packaging, through silicon vias (STV) filling and underfilling:

It takes special engineering for adhesives and underfill to flow into a thin layer of 25-100 micron gaps and through small silicon vias (STV) to provide stress relief even for large area dies.

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1. MC7880 is designed for flip chip underfilling and filling through silicon vias operating environment

  • Low viscosity at relatively low temperatures of 40-80°C
  • Ambient pot-life of over 5 days with low moisture sensitivity
  • Rapid curing in seconds at 150°C-200°C
  • Low coefficient of expansion (CTE) of less than 30 ppm/°C
  • Maintain high modulus of more than 6 GPa up to 200°C
  • Long term stability at temperatures higher than 200°C
  • Ideal for flip chip direct contact packaging and thermal compression or thermosonic fusion flip chip packaging

2. MC7883 is designed to replace traditional moisture sensitive underfill materials:

  • High flow at relatively low temperatures of 40-80°C
  • Ambient pot-life of over 5 days with low moisture sensitivity
  • Rapid curing in seconds at 150°C-200°C
  • Low coefficient of expansion (CTE) of less than 19 ppm/°C
  • Maintain high modulus of more than 8 GPa up to 200°C
  • Long term stability at temperatures higher than 200°C

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Electrically Conductive Paste Adhesives Click on the Product for the TDS

AIT Product Characteristics Electrical Resistivity (ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear(psi) Tg (°C) Viscosity/ Thixotropic IndeX
EG8020
  • One or two part component
<2×10-4 >5.7 >1,700 50 150,000(cps@ 0.5 rpm)
EG8050-LV
  • Solder replacement-
  • Stress free-Substrate/component
<4×10-4 >7.9 >1,500 -20 129,000(cps@ 0.5 rpm)
EG8050
  • Solder replacement
  • Stress free
<4×10-4 >7.9 >1,800 -20 190,000(cps@ 0.5 rpm)
ME8155
  • Stress free
  • Solvent free
<4×10-4 >7.9 >1,500 -20 354,000(cps@ 0.5 rpm)
ME8452-A
  • Stress free
  • Solvent free
  • Large area die attach
<4×10-4 >7.9 >2,000 -20 255,000(cps@ 0.5 rpm)
ME8456
  • Stress free
  • Large area die attach
<4×10-4 >7.9 >2,000 -20 130,000(cps@ 0.5 rpm)
ME8456-00
  • Ideal for mismatched CTE’s
<4×10-4 >12.5 >1,200 -20 60,000(cps@ 0.5 rpm)
ME8512
  • Solvent free
  • Designed to eliminate bleeding
<4×10-4 >7.9 >1,600 50 910,000(cps@ 0.5 rpm)
ME8550-DA
  • High green strength
  • Moisture resistant
<4×10-4 >7.9 >1,000 -55 20,000(cps@ 5 rpm)
ME8630-DA
  • Solvent free
  • Fine pich
  • Rapid curing
<2×10-4 >8.6 >2,500 50 8,000(cps@ 0.5 rpm) TI >4.0
ME8630-RC
  • Solvent free
  • Fine pitch
  • Rapid curing for inline process
<5×10-4 >8.6 >2,400 80 15,000(cps@ 5 rpm) TI >4.0
ME8650-DA
  • Solvent free
  • Fine pitch
  • Rapid curing
<4×10-4 >7.9 >1,000 -20 8,000(cps@ 0.5 rpm) TI >4.0
ME8650-RC
  • Solvent free
  • Fine picth
  • Rapid curing for inline process
<4×10-4 >7.9 >1,000 -20 15,000(cps@ 5 rpm) TI >4.0
ME8850-DA
  • Stress free
  • High Green Strength
<5×10-4 >7.9 >1,000 -20 15,000(cps@ 5 rpm)
MC8880
  • Solvent free
  • Withstands 350 Deg C
  • Low Moisture Absorption
  • Low Ionics
<4×10-4 >6.9 >2,500 240 30,000(cps@ 5 rpm)

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Non-conductive Paste Adhesives

AIT Product Characteristics Electrical Resistivity(ohm-cm) Thermal Conductivity(watt/m-°C) Die-shear (psi) Tg (°C) Viscosity
EG7655
  • Stress free
  • One or two component
  • Large bonding areas
>1×1014 >1.7 >1,800 -20 300,000(cps@ 0.5 rpm)
EG7658
  • Substrate attach
  • Large bonding areas
  • Bonding mismatched CTE’s
>1×1014 >3.67 >1,800 -25 337,000(cps@ 0.5 rpm)
ME7155
  • Solvent free
  • Stress free
>1×1014 >1.7 >1,800 -25 276,000(cps@ 0.5 rpm)
ME7155-AN
  • Solvent free
  • Stress free
>1×1014 >3.6 >1,800 -25 245,000(cps@ 0.5 rpm)
ME7156
  • Stress free
  • Mismatched CTE’s
>1×1014 >1.7 >2,400 -25 144,000(cps@ 0.5 rpm)
ME7158
  • Stress free
  • High power die attach
>1×1014 >3.6 >1,800 -25 250,000(cps@ 0.5 rpm)
ME7159
  • Stress free
  • Diamond filled
>1×1014 >11.4 >1,800 -25 310,000(cps@ 0.5 rpm)
ME7556-DA
  • Stress free
  • Moisture resistant
>1×1014 >3.6 >1,600 -55 20,000(cps@ 5 rpm)
ME7635-RC
  • Solvent free
  • Rapid inline curing
  • More than 7 days pot-life
>1×1014 >1.6 >2,800 -20 10,000(cps@ 0.5 rpm) TI >3.0
ME7655-RC
  • Solvent free
  • Rapid inline curing
  • More than 7 days pot-life
>1×1014 >1.8 >2,800 65 10,000(cps@ 0.5 rpm) TI >3.0
ME7656
  • Stress free
  • Fast curing
>1×1014 >3.6 >1,200 -10 200,000(cps@ 0.5 rpm)
ME7665-DA
  • Solvent free
  • Low temperature curing
>1×1014 >1.7 >2,000 80 20,000(cps@ 5 rpm)
ME7857-SC
  • Solvent free
  • High Green Strength
>1×1013 >2.9 >1,200 -60 60,000(cps@ 5 rpm)
ME7863
  • Solvent free
  • Withstands 350 Deg C
  • Low Moisture Absorption
  • Low Ionics
NA >1.0 >2,500 240 7,000(cps@ 5 rpm)

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to the Products Application Form to receive a recommendation from our office for your specific application.