AI Technology, Inc.

RELIABLE DIE ATTACH ADHESIVE AND UNDERFILL FOR LARGE AND SMALL DIES IN FLIP CHIP PACKAGING, STACK CHIP PACKAGING AND THROUGH SILICON VIA FILLING

AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing. Some of the following representative products have more than 20 years of reliability data for military and aerospace applications.

New adhesive underfill and stress relief material innovations for advanced stack chip packaging, flip chip packaging, through silicon via (STV) filling and underfilling:

It takes special engineering adhesive and underfill to flow into thin layer of 25-100 micron gaps and small through silicon via (STV) to provide stress relief even for the large area dies.

MC7880 is designed exactly for flip chip underfilling and through silicon via filling operating environment
- Low viscosity at relatively low temperature of 40-80^oC
- Ambient pot-life of over 5 days with low moisture sensitivity
- Rapid curing in seconds at 150^oC-200^oC
- Low coefficient of expansion (CTE) of less than 30 ppm/^oC
- Maintain high modulus of more than 6 GPa up to 200^oC
- Long term stability at temperature higher than 200^oC
- Ideal for flip chip direct contact packaging and thermocompression or thermosonic fusion flip chip packaging
MC7883 is designed to replace traditional moisture sensitive underfill materials:

High flow at relatively low temperature of 40-80^oC

Ambient pot-life of over 5 days with low moisture sensitivity

Rapid curing in seconds at 150^oC-200^oC

Low coefficient of expansion (CTE) of less than 19 ppm/^oC

Maintain high modulus of more than 8 GPa up to 200^oC

Long term stability at temperature higher than 200^oC

Electrically Conductive Paste Adhesives

Click on the Product for the TDS

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity(watt/m-^oC)	Die-shear(psi)	Tg (^oC)	Viscosity/ Thixotropic IndeX
EG8020	-One or two part component	<2x10^-4	>5.7	>1,700	50	150,000 (cps@ 0.5 rpm)
EG8050-LV	-Solder replacement -Stress free -Substrate/component	<4x10^-4	>7.9	>1,500	-20	129,000 (cps@ 0.5 rpm)
EG8050	-Solder replacemernt -Stress free	<4x10^-4	>7.9	>1,800	-20	190,000 (cps@ 0.5 rpm)
ME8155	-Stress free -Solvent free	<4x10^-4	>7.9	>1,500	-20	354,000 (cps@ 0.5 rpm)
ME8452-A	-Stress free -Solvent free -Large area die attach	<4x10^-4	>7.9	>2,000	-20	255,000 (cps@ 0.5 rpm)
ME8456	-Stress free -Large area die attach	<4x10^-4	>7.9	>2,000	-20	130,000 (cps@ 0.5 rpm)
ME8456-00	-Ideal for mismatched CTE's	<4x10^-4	>7.9	>1,500	-20	60,000 (cps@ 0.5 rpm)
ME8512	-Solvent free -Designed to eliminate bleeding	<4x10^-4	>7.9	>1,600	50	910,000 (cps@ 0.5 rpm)
ME8550-DA	-High green strength -Moisture resistant	<4x10^-4	>7.9	>1,000	-55	20,000 (cps@ 5 rpm)
ME8630-DA	-Solvent free -Fine pich -Rapid curing -Meets MIL-STD 883 5011.4	<2x10^-4	>8.6	>2,500	50	8,000 (cps@ 0.5 rpm) TI >4.0
ME8630-RC	-Solvent free -Fine pich -Rapid curing for inline process -Meets MIL-STD 883F 5011.4	<5x10^-4	>8.6	>2,400	80	15,000 (cps@ 5 rpm) TI >4.0
ME8650-DA	-Solvent free -Fine pich -Rapid curing -Meets MIL-STD 883F 5011.4	<4x10^-4	>7.9	>1,000	-20	8,000 (cps@ 0.5 rpm) TI >4.0
ME8650-RC	-Solvent free -Fine pich -Rapid curing for inline process -Meets MIL-STD 883F 5011.4	<4x10^-4	>7.9	>1,000	-20	15,000 (cps@ 5 rpm) TI >4.0
ME8850-DA	-Stress free -High Green Strength	<5x10^-4	>7.9	>1,000	-20	15,000 (cps@ 5 rpm)
MC8880	-Solvent free -Withstands 350 Deg C -Low Moisture Absorption -Low Ionics	<4x10^-4	>6.9	>2,500	240	30,000 (cps@ 5 rpm)

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

Non-conductive Paste Adhesives

AIT Product	Characteristics	Electrical Resistivity(ohm-cm)	Thermal Conductivity(watt/m-^oC)	Die-shear (psi)	Tg (^oC)	Viscosity
EG7655	-Stress free -One or two component -Large bonding areas	>1x10¹⁴	>1.7	>1,800	-20	300,000 (cps@ 0.5 rpm)
EG7658	-Substrate attach -Large bonding areas -Bonding mismatched CTE's	>1x10¹⁴	>3.67	>1,800	-25	337,000 (cps@ 0.5 rpm)
ME7155	-Solvent free -Stress free	>1x10¹⁴	>1.7	>1,800	-25	276,000 (cps@ 0.5 rpm)
ME7155-AN	-Solvent free -Stress free	>1x10¹⁴	>3.6	>1,800	-25	245,000 (cps@ 0.5 rpm)
ME7156	-Stress free -Mismatched CTE's	>1x10¹⁴	>1.7	>2,400	-25	144,000 (cps@ 0.5 rpm)
ME7158	-Stress free -High power die attach	>1x10¹⁴	>3.6	>1,800	-25	250,000 (cps@ 0.5 rpm)
ME7159	-Stress free -Diamond filled	>1x10¹⁴	>11.4	>1,800	-25	310,000 (cps@ 0.5 rpm)
ME7556-DA	-Stress free -Moisture resistant	>1x10¹⁴	>3.6	>1,600	-55	20,000 (cps@ 5 rpm)
ME7635-RC	-Solvent free -Rapid inline curing -More than 7 days pot-life -Meets MIL-STD 883F 5011.4	>1x10¹⁴	>1.6	>2,800	-20	10,000 (cps@ 0.5 rpm) TI >3.0
ME7655-RC	-Solvent free -Rapid inline curing -More than 7 days pot-life -Meets MIL-STD 883F 5011.4	>1x10¹⁴	>1.8	>2,800	65	10,000 (cps@ 0.5 rpm) TI >3.0
ME7656	-Stress free -Fast curing	>1x10¹⁴	>3.6	>1,200	-10	200,000 (cps@ 0.5 rpm)
ME7665-DA	-Solvent free -Low temperature curing	>1x10¹⁴	>1.7	>2,000	80	20,000 (cps@ 5 rpm)
ME7857-SC	-Solvent free -High Green Strength	>1x10¹³	>2.9	>1,200	-60	60,000 (cps@ 5 rpm)
ME7863	-Solvent free -Withstands 350 Deg C -Low Moisture Absorption -Low Ionics	NA	>1.0	>2,500	240	7,000 (cps@ 5 rpm)

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

To achieve the highest level of ease in component soldering operations without pre-baking, AIT die-attach pastes have been engineered with molecular structure of low moisture absorption. This low moisture absorption is reflected in the consistent bond strength under extreme moisture exposure.

With the increase usage of lead-free soldering, high temperature stability is critical. Low weight loss is engineered into AIT die-attach paste adhesives using stable molecular structure. The following weight loss measure is a good indicator of the ability of AIT die-attach pastes in withstanding a higher temperature soldering operation and long-term high temperature applications.

To enhance the productivity of the die-attach operations, AIT die-attach pastes for commercial high volume applications have been designed with 100% solids without diluent or solvent. The use of fast curing agents enables the adhesive to cure rapidly. They are ideal for in-line curing manufacturing without additional post curing.