To achieve the highest level of ease in component soldering operations without pre-baking, AIT die-attach pastes have been engineered with molecular structure of low moisture absorption. This low moisture absorption is reflected in the consistent bond strength under extreme moisture exposure.
With the increased usage of lead-free soldering, high temperature stability is critical. Low weight loss is engineered in AIT die-attach paste adhesives using a stable molecular structure. The following weight loss measure is a good indicator of the ability of AIT die-attach pastes to withstand higher temperature soldering operations and long-term high temperature applications.
To enhance the productivity of die-attach operations, AIT die-attach pastes for high volume applications have been designed with 100% solids without diluent or solvent. The use of fast curing agents enables the adhesive to cure rapidly. They are ideal for in-line curing manufacturing without additional post curing.
AIT also designed the die-attach pastes with long pot-life for high volume applications to ensure success in manufacturing operations.
For more information and recommendation assistance, please contact AIT sales and engineering:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
Reliable Die Attach Adhesive And Underfill For Large And Small Dies In Flip Chip Packaging, Stack Chip Packaging And Through Silicon Via Filling
AIT offers some of the most advanced Die Attach paste adhesives engineered to improve long-term reliability, rapid inline curing, long pot-life, viscosity and thixotropic control for fast automated dispensing and manufacturing. Some of the following representative products have more than 20 years of reliability data for military and aerospace applications.
New adhesive underfill and stress relief material innovations for advanced stack chip packaging, flip chip packaging, through silicon vias (STV) filling and underfilling:
It takes special engineering for adhesives and underfill to flow into a thin layer of 25-100 micron gaps and through small silicon vias (STV) to provide stress relief even for large area dies.
1. MC7880 is designed for flip chip underfilling and filling through silicon vias operating environment
- Low viscosity at relatively low temperatures of 40-80°C
- Ambient pot-life of over 5 days with low moisture sensitivity
- Rapid curing in seconds at 150°C-200°C
- Low coefficient of expansion (CTE) of less than 30 ppm/°C
- Maintain high modulus of more than 6 GPa up to 200°C
- Long term stability at temperature higher than 200°C
- Ideal for flip chip direct contact packaging and therm°Compression or thermosonic fusion flip chip packaging
2. MC7883 is designed to replace traditional moisture sensitive underfill materials:
- High flow at relatively low temperatures of 40-80°C
- Ambient pot-life of over 5 days with low moisture sensitivity
- Rapid curing in seconds at 150°C-200°C
- Low coefficient of expansion (CTE) of less than 19 ppm/°C
- Maintain high modulus of more than 8 GPa up to 200°C
- Long term stability at temperature higher than 200°C
Electrically Conductive Paste Adhesives Click on the Product for the TDS
| AIT Product | Characteristics | Electrical Resistivity (ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear(psi) | Tg (°C) | Viscosity/ Thixotropic IndeX |
|---|---|---|---|---|---|---|
| EG8020 |
|
<2x10-4 | >5.7 | >1,700 | 50 | 150,000(cps@ 0.5 rpm) |
| EG8050-LV |
|
<4x10-4 | >7.9 | >1,500 | -20 | 129,000(cps@ 0.5 rpm) |
| EG8050 |
|
<4x10-4 | >7.9 | >1,800 | -20 | 190,000(cps@ 0.5 rpm) |
| ME8155 |
|
<4x10-4 | >7.9 | >1,500 | -20 | 354,000(cps@ 0.5 rpm) |
| ME8452-A |
|
<4x10-4 | >7.9 | >2,000 | -20 | 255,000(cps@ 0.5 rpm) |
| ME8456 |
|
<4x10-4 | >7.9 | >2,000 | -20 | 130,000(cps@ 0.5 rpm) |
| ME8456-00 |
|
<4x10-4 | >12.5 | >1,200 | -20 | 60,000(cps@ 0.5 rpm) |
| ME8512 |
|
<4x10-4 | >7.9 | >1,600 | 50 | 910,000(cps@ 0.5 rpm) |
| ME8550-DA |
|
<4x10-4 | >7.9 | >1,000 | -55 | 20,000(cps@ 5 rpm) |
| ME8630-DA |
|
<2x10-4 | >8.6 | >2,500 | 50 | 8,000(cps@ 0.5 rpm) TI >4.0 |
| ME8630-RC |
|
<5x10-4 | >8.6 | >2,400 | 80 | 15,000(cps@ 5 rpm) TI >4.0 |
| ME8650-DA |
|
<4x10-4 | >7.9 | >1,000 | -20 | 8,000(cps@ 0.5 rpm) TI >4.0 |
| ME8650-RC |
|
<4x10-4 | >7.9 | >1,000 | -20 | 15,000(cps@ 5 rpm) TI >4.0 |
| ME8850-DA |
|
<5x10-4 | >7.9 | >1,000 | -20 | 15,000(cps@ 5 rpm) |
| MC8880 |
|
<4x10-4 | >6.9 | >2,500 | 240 | 30,000(cps@ 5 rpm) |
Non-conductive Paste Adhesives
| AIT Product | Characteristics | Electrical Resistivity(ohm-cm) | Thermal Conductivity(watt/m-°C) | Die-shear (psi) | Tg (°C) | Viscosity |
|---|---|---|---|---|---|---|
| EG7655 |
|
>1x1014 | >1.7 | >1,800 | -20 | 300,000(cps@ 0.5 rpm) |
| EG7658 |
|
>1x1014 | >3.67 | >1,800 | -25 | 337,000(cps@ 0.5 rpm) |
| ME7155 |
|
>1x1014 | >1.7 | >1,800 | -25 | 276,000(cps@ 0.5 rpm) |
| ME7155-AN |
|
>1x1014 | >3.6 | >1,800 | -25 | 245,000(cps@ 0.5 rpm) |
| ME7156 |
|
>1x1014 | >1.7 | >2,400 | -25 | 144,000(cps@ 0.5 rpm) |
| ME7158 |
|
>1x1014 | >3.6 | >1,800 | -25 | 250,000(cps@ 0.5 rpm) |
| ME7159 |
|
>1x1014 | >11.4 | >1,800 | -25 | 310,000(cps@ 0.5 rpm) |
| ME7556-DA |
|
>1x1014 | >3.6 | >1,600 | -55 | 20,000(cps@ 5 rpm) |
| ME7635-RC |
|
>1x1014 | >1.6 | >2,800 | -20 | 10,000(cps@ 0.5 rpm) TI >3.0 |
| ME7655-RC |
|
>1x1014 | >1.8 | >2,800 | 65 | 10,000(cps@ 0.5 rpm) TI >3.0 |
| ME7656 |
|
>1x1014 | >3.6 | >1,200 | -10 | 200,000(cps@ 0.5 rpm) |
| ME7665-DA |
|
>1x1014 | >1.7 | >2,000 | 80 | 20,000(cps@ 5 rpm) |
| ME7857-SC |
|
>1x1013 | >2.9 | >1,200 | -60 | 60,000(cps@ 5 rpm) |
| ME7863 |
|
NA | >1.0 | >2,500 | 240 | 7,000(cps@ 5 rpm) |
AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.
