Flip-Chip Die-Attach and Interconnections with Flexible Conductive Adhesives:
◊ Patented and proven reliability of flip-chip interconnections with flexible conductive adhesive.
◊ Simple flip-chip attach process with conductive adhesive on substrate-interposer:
o Stencil LRTC 8550 onto precious metal bond pads on substrate-interposer.
o B-stage the adhesive at ambient to 60°C.
o Place flip-chip with precious metal bond-pad or bumps onto the respective substrate-interposer.
o Cure the device interconnection at temperature 80-200°C without applied pressure.
o Optional underfill with flexible protection encapsulation (ME 7150 water-like viscosity for defect free underfilling).
◊ Alternative flip-chip attach process with conductive adhesive on wafer-chip:
o Stencil ESS8450 (or PSS 8150) onto precious metal bond pads on wafer-chip.
o B-stage the adhesive at ambient to 60°C.
o Place flip-chip with conductive adhesive onto the respective substrate-interposer with precious metal bond-pad or bumps that is heated to above 200°C.
o Cure the device interconnection at temperature 200°C without pressure.
o Optional underfill with flexible protection encapsulation (me 7150 water-like viscosity for defect free underfilling).
◊ Adhesive absorbed less than 0.15% even at saturated moisture at 100°C. Devices have passed most stringent military specification for components.
◊ One of the most stable adhesive for high temperature exposures with TGA degradation well above 390°C
FLIP-CHIP FLEXIBLE CONDUCTOR ADHESIVE BUMPS
Solder Joint Replacement: Patent Pending
|
AIT Product
|
Resistivity
(ohm-cm)
|
Current Capability
(Amp/mm2)
|
Tg
(°C)
|
Die-Shear
(psi)
|
Max. Temp.
(°C)
under load
of 100 psi
|
Off-line Melt-Bonding
(@10psi after B-staging)
|
|
|
(Ag, Thermoplastic)
|
< 3x10-4
|
>20
|
-55
|
>1,000
|
150
|
Instant Melt-Bonding, >190° C
|
|
|
PSS8159
(Au, Thermoplastic)
|
< 3x10-3
|
>20
|
-55
|
>1,000
|
150
|
Instant Melt-Bonding, >190° C
|
|
|
(Ag, Flexible Epoxy)
|
< 3x10-4
|
>20
|
-60
|
>2,000
|
250
|
Rapid-Curing Epoxy @>100° C
|
|
|
(Pd, Flexible Epoxy)
|
< 3x10-3
|
>20
|
-60
|
>2,000
|
250
|
Rapid-Curing Epoxy @>100° C
|
|
|
(Au, Flexible Epoxy)
|
< 3x10-3
|
>20
|
-60
|
>2,000
|
250
|
Rapid-Curing Epoxy @>100° C
|
|
|
Wafer & Substrate Precision bumpings down to 50 micron bumps and 100 micron pitch
Bumping Services Bump height of 50-75 micron for bump diameter of 50-75 micron
With Conductor-Adhesive Clean-room operation for substrate panel of 12"x12"
|
|||||||
FLEXIBLE UNDERFILL FOR INSULATION & PROTECTION
|
AIT Product
|
Resistivity
(ohm-cm)
|
Dielectric Strength
(volt/mil)
|
Thermal Conductivity
(W/m-° C)
|
Tg
(°C)
|
Die Shear
(psi @ 25°C
/150°C)
|
Modulus (psi)/ Poisson Ratio
|
Curing Conditions
|
|
(Flexible)
|
>1x10114
|
750
|
0.20
|
-30
|
1,000/50
|
6,000/0.45
|
125oC
10 min.
|
|
(Alumina epoxy)
|
>1x10114
|
750
|
1.6
|
-30
|
5,000/50
|
9,000/0.45
|
125oC
10 min.
|
Previous page: Dicing & Grinding Tape FAQs
Next page: EMI/RFI Shielding & ESD Protection Materials