AI Technology, Inc.

• 1: Home
• 2: Company
• 3: Products & Solutions
  • 3.1: Die Attach Adhesive Solutions
    • 3.1.1: Die Attach Paste Adhesives
    • 3.1.2: Die Attach Film Adhesives
    • 3.1.3: Die Attach Adhesive FAQs
  • 3.2: Substrate and Component Attach
    • 3.2.1: Component & Substrate Attach Paste Adhesives
    • 3.2.2: Substrate Attach Film Adhesives
  • 3.3: Thermal Interface Materials & Insulated Metal Substrates
    • 3.3.1: Compressible Phase-Change Interfaces
    • 3.3.2: Thermal Film and Paste Adhesives
    • 3.3.3: Thermal Gels & Greases
    • 3.3.4: Insulated Metal Substrate Copper Clads & Pre-Preg
    • 3.3.5: Thermal Management Tips and FAQs
  • 3.4: Flexible and Advanced Circuit Substrate Materials
    • 3.4.1: Solderable Flexible 1 and 2-Sided Copper Laminates
    • 3.4.2: Low Pressure Copper Pre-Preg
    • 3.4.3: Advanced Circuit Substrate Materials
  • 3.5: Lid Seal Solutions
    • 3.5.1: Lid Seal Preforms
    • 3.5.2: Solderable Insulating Lids
  • 3.6: Dicing & Grinding Tapes and Greases
    • 3.6.1: Dicing Tapes
    • 3.6.2: Grinding Tapes and Greases
    • 3.6.3: Dicing & Grinding Tape FAQs
  • 3.7: Flip Chip Adhesive Bumps
  • 3.8: EMI/RFI Shielding & ESD Protection Materials
    • 3.8.1: Compressible Gasket Sheets
    • 3.8.2: Shielding Caulks and Adhesives
    • 3.8.3: Melt-Bonding Lid-Shield
    • 3.8.4: ESD Protection Coatings & Materials
    • 3.8.5: EMI Shielding Tips and FAQs
  • 3.9: MIL-STD 883C 5011.4 Compliant
  • 3.10: NASA Outgassing Compliant
  • 3.11: Custom Adhesive & Material Solutions
• 4: Contact
• 5: Resources & Glossary
  • 5.1: Adhesive Bonding Principle
  • 5.2: Rework Process
  • 5.4: Patents & IP
  • 5.5: ISO 9001:2000 Certification
• 7: News & Shows
  • 7.1: News Releases
  • 7.2: Newsletter-Adherent
• 8: Online Store
• 9: Employment
• 10: Legal

AIT designs and manufactures one of the most comprehensive series of film and paste adhesives and interfaces for use in microelectronics and electronic packaging. Applications include die-attach, substrate and component attach, heatsink and heatpipe attach; gap filling thermla interfaces; flexible circuit substrate and interposers, EMI shielding sheets and gaskets, and hermetic lid seals.

AIT application engineering, sales, chemists and material scientists are ready to serve your special needs and applications.  Please inform us of your requirements using the contact/application assistance page:  

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308