AI Technology, Inc.

• 1: Home
• 2: Company
• 3: Products & Solutions
  • 3.1: Die Attach Adhesive Solutions
    • 3.1.1: Die Attach Paste Adhesives
    • 3.1.2: Die Attach Film Adhesives
    • 3.1.3: Die Attach Adhesive FAQs
  • 3.2: Substrate and Component Attach
    • 3.2.1: Component & Substrate Attach Paste Adhesives
    • 3.2.2: Substrate Attach Film Adhesives
  • 3.3: Thermal Interface Materials & Insulated Metal Substrates
    • 3.3.1: Compressible Phase-Change Interfaces
    • 3.3.2: Thermal Film and Paste Adhesives
    • 3.3.3: Thermal Gels & Greases
    • 3.3.4: Insulated Metal Substrate Copper Clads & Pre-Preg
    • 3.3.5: Thermal Management Tips and FAQs
  • 3.4: Flexible and Advanced Circuit Substrate Materials
    • 3.4.1: Solderable Flexible 1 and 2-Sided Copper Laminates
    • 3.4.2: Low Pressure Copper Pre-Preg
    • 3.4.3: Advanced Circuit Substrate Materials
  • 3.5: Lid Seal Solutions
    • 3.5.1: Lid Seal Preforms
    • 3.5.2: Solderable Insulating Lids
  • 3.6: Dicing & Grinding Tapes and Greases
    • 3.6.1: Dicing Tapes
    • 3.6.2: Grinding Tapes and Greases
    • 3.6.3: Dicing & Grinding Tape FAQs
  • 3.7: Flip Chip Adhesive Bumps
  • 3.8: EMI/RFI Shielding & ESD Protection Materials
    • 3.8.1: Compressible Gasket Sheets
    • 3.8.2: Shielding Caulks and Adhesives
    • 3.8.3: Melt-Bonding Lid-Shield
    • 3.8.4: ESD Protection Coatings & Materials
    • 3.8.5: EMI Shielding Tips and FAQs
  • 3.9: MIL-STD 883C 5011.4 Compliant
  • 3.10: NASA Outgassing Compliant
  • 3.11: Custom Adhesive & Material Solutions
• 4: Contact
• 5: Resources & Glossary
  • 5.1: Adhesive Bonding Principle
  • 5.2: Rework Process
  • 5.4: Patents & IP
  • 5.5: ISO 9001:2000 Certification
• 7: News & Shows
  • 7.1: News Releases
  • 7.2: Newsletter-Adherent
• 8: Online Store
• 9: Employment
• 10: Legal

The Adherent: Newsletter of AI Technology

  New Technology from AIT

AIT UV DAF Solution

There are so many acronyms in microelectronic packaging most engineers slowly lose the grasp of sensible language and sink deeper and deeper into the depravity of jargon, as illustrated by the following: “We need UV DAF for QFN, and also ACP or ACF for FPBGA in CMOS and ASIC for our SDRAM and MCM respectively. CPCM would be ideal for TIM.” Shakespeare would turn over in his grave. But, never fear! We have pioneered what is "hip" today with our persistent adherence to engineer geekdom. With all that’s said, AIT is proud to introduce Ultraviolet Release Dicing and Die Attach Film, aptly dubbed UVR DDAF or UVR-DAF (Call it uber-daf if you wish).

AI Technology’s unique, controlled-flow, void-free, silicone-free, thermally conductive, dielectric or conductive die attach film is provided on a UV-release dicing tape. All you have to do to package your die is to 1) Mount your wafer on the tape with some heat and pressure, 2) dice normally, 3) shine UV light on the tape, 4) pick and place, then 5) cure the film in an oven for about an hour. UV-exposure guarantees clean transfer of DAF on the die. It’s reliability and simplicity combined into one to make your packaging process take much less time. Sounds intriguing? Visit AI Technology’s website and fill out an application analysis form for a sample sheet.

Double sided Flexible PCB from AI Technology

Coupler is AI Technology’s flexible, directly solderable circuit substrate that has ultra-low moisture absorption, low dielectric constant, and low loss. Ideal for high frequency applications, now Coupler breaks new ground with Coupler DS: Clad in both sides with ½ oz copper, DS opens up a wide range of process solutions. Click on our "AIT, solve my problem" button, and fill out an application analysis form for a sample. Etch the pattern. Build your circuit. Make life better with Coupler from AIT.