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The bench-mark thermal performance measured illustrated above demonstrated more than 2-3 temperature centigrade lower junction temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.

 

 

AIT offers one of the most comprehensive thermal greases and thermal gels with the lowest thermal resistance ever documented. The following tables represent some of these innovative interface material solutions and advantages:

· The lowest thermal interface resistance greases and gels ever documented

· All non-silicone based and non-migrating designed for delicate electronics

· In-situ curing thermal interface gels are first in the industry

· Available as electrically conductive or electrically insulating versions.

 

The bench-mark thermal performance measured for an AIT non-silver based thermal interface gel (COOL-GEL®) illustrated above demonstrated more than 1 temperature centigrade lower junction temperatures over the industry "standards" of silver-based products even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.

 

Electrically Insulating Thermal Gels and Greases
(Click on the Product for the TDS)

AIT Product
Characteristics
Electrical Resistivity (ohm-cm)
Thermal Conductivity(watt/m-oC)
Dielectric
Strength
(volt/mil)
Die-shear (psi)
Tg (oC)
COOL-GREASE®
CGR7015

-Non-silicone thermal grease
-Aluminum Oxide filled

>1x1014

>2.0

N/A

N/A

Grease
-Non-silicone thermal grease
-Boron Nitride Filled

>1x1014

>4.0

N/A

N/A

Grease
COOL-GREASE®
CGR7018
-Non-silicone thermal grease
-Aluminum Nitride Filled

>1x1014

>4.0

N/A

N/A

Grease
COOL-GREASE®
CGR7019
-Non-silicone thermal grease
-Diamond Filled

>1x1013

10.0

 N/A

N/A

Grease
COOL-GEL®
CGL7015
-Non-silicone thermal gel
-Aluminum Oxide Filled

>1x1013

>2.0

 300

<300

-60
COOL-GEL®
CGL7018
-Non-silicone thermal gel
-Aluminum Nitride Filled

>1x1014

>4.1

 300

<300

-60
COOL-GEL®
CGL7019
-Non-silicone thermal gel
-Diamond Filled

>1x1014

>5.7

 300

<300

-60
COOL-GEL®
CGL7056-XT
-Interface/Potting gel
-Boron Nitride Filled

>1x1014

>4.1

500

<300

-65
COOL-GEL®
CGL7058
-Interface/Potting gel
-Aluminum Nitride Filled

>1x1014

>4.3

 500

<300

-65
COOL-SILVERTM
-Lowest thermal resistance
-Non-silicone thermal grease
 Non-Conductive 
in Bulk

>12

N/A

N/A

 Grease

AIT offers many other gels, greases, and other thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.

 

 

Electrically Conductive Thermal Gels and Greases
(Click on the Product for the TDS)

AIT Product
Characteristics
Electrical Resistivity (ohm-cm)
Thermal Conductivity(watt/m-oC)
Die-shear (psi)
Tg (oC)

-Non-silicone thermal grease

<5x10-3

>8.6

N/A

Grease
ELECTRO-GREASE
ELGR8517
-Non-silicone thermal grease
-Lower cost solution

<1x10-3

>6.4

N/A

Grease
COOL-GREASE
CGR8010-XT
-Non-silicone thermal grease
-Very high thermal conductivity

<5x10-3

>12.9

N/A

Grease
COOL-GEL®
CGL8010-XT
-Form Gel @ 800C
-Ideal for Power Devices

<1x10-4

>8.6

<300

Gel
COOL-GEL®
CGL8013-XT
-Silver Coated Copper filled
-Lower Cost option

<1x10-2

>8.6

<300

Gel

-Non-silicone thermal gel

<1x10-4

>8.6

<300

Gel

AIT, solve my problem!

 

 

The failure rate of an electronic device doubles with every 10°C increase in chip junction temperature.