Printing Die Attach Film Adhesives

RELIABLE DIE ATTACH ADHESIVE AND UNDERFILL FOR LARGE AND SMALL DIES IN FLIP CHIP PACKAGING, STACK CHIP PACKAGING AND THROUGH SILICON VIA FILLING

AIT pioneered the use of flexible die-attach film for large area die-attachment and has since achieved 20 years of proven reliability. Continuing with this innovative heritage, the following "Die-Attach Film" adhesives represents products that are engineered for manufacturability and reliability:

Die-attach film that can be pre-applied onto wafer by lamination or screening
Applicable for dicing with UV-release tape
Instant melt-tack with nominal pressure and finishing inline curing without fixture or pressure
Ability to withstand 250°C wire-bonding
Low moisture absorption to achieve soldering of components without pre-baking
Industry first “instant melt-bondable” thermoplastic die-attach films

New film adhesive underfill and stress relief material innovations for advanced stack chip packaging, flip chip packaging, through silicon via (STV) filling and underfilling:

It takes special engineering film adhesive for backside die attach and flip chip underfilling.

CXP7880-UF is designed exactly for flip chip underfilling with solder bumps reflow bonded, thermosonic or thermocompression bonded, and direct contact interconnections flow underfilling
- Direct melt flow at relatively low temperature of 60-90^oC
- Ambient application pot-life of over 30 days with low moisture sensitivity
- Rapid curing in seconds at 150^oC-200^oC
- Low coefficient of expansion (CTE) of less than 30 ppm/^oC
- Maintain high modulus of more than 6 GPa up to 220^oC
- Long term stability at temperature higher than 220^oC
- Ideal for flip chip direct contact packaging and thermocompression or thermosonic fusion flip chip packaging
CXP8880 is designed to replace traditional wafer level dicing die attach epoxy based adhesive materials:

High flow at relatively low temperature of 60-90^oC

Ambient application pot-life of over 30 days with low moisture sensitivity

Rapid curing in seconds at 150^oC-200^oC

Low coefficient of expansion (CTE) of less than 20 ppm/^oC

Maintain high modulus of more than 8 GPa up to 220^oC

Long term stability at temperature higher than 220^oC

Non-conductive Film Adhesives

Click on the Product for the TDS

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity (watt/m-^oC)	Die-shear (psi)	Tg (^oC)	Film Type
ESP7450-WL	-Wafer pre-application -Instant melt-tack >120°C (<10 psi) -Curing without fixture and pressure -Withstand >150°C wire-bonding -Low moisture absorption -Proven reliability for large area dies	>1x10¹⁴	>1.2	>1,500	-45	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP7455-W	-Wafer pre-application -Instant melt-tack >120°C (<10 psi) -Curing without fixture and pressure -Withstand >150°C wire-bonding -Low moisture absorption -Proven reliability for large area dies	>1x10¹⁴	>2.0	>1,500	-45	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP7670-WL	-Wafer pre-application -Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Proven reliability for multilayer stack	>1x10¹⁴	>1.2	>3,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP7675	-Wafer pre-application -Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Proven reliability for multilayer stack	>1x10¹⁴	>2.0	>3,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
RTK7556	-Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Proven reliability for large area dies	>1x10¹⁴	>3.0	>1,500	-45	Tacky film Preforms 1.5 mils (thick) 3.0 mils (thick)
TP7155	-Wafer pre-application -Instant melt-bond >190°C (<10 psi) -No post curing -Withstand >150°C wire-bonding -Low moisture absorption	>1x10¹⁴	>1.7	>1,500	-40	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
CXP7880	-Wafer pre-application -Instant melt-bond >290°C (<10 psi) -Low coefficient of thermal expansion ->300°C continuous use -High moisture resistance	^>1x10¹⁴	>0.3	>2,000	240	Tack free dry film Preforms 1.0 mils (thick) 2.0 mils (thick)

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

Electrically Conductive Film Adhesives

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity (watt/m-^oC)	Die-shear (psi)	Tg (^oC)	Film Type
ESP8450-W	-Wafer pre-application -Instant melt-tack >120°C (<10 psi) -Curing without fixture and pressure -Withstand >150°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for large area dies	<4x10-⁴	>6.0	>1,500	-45	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
ESP8680-W	-Wafer pre-application -Instant melt-tack >80°C (<10 psi) -Curing without fixture and pressure -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for multilayer stack	^<4x10-⁴	>6.0	>3,000	80	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
RTC8750	-Instant melt-tack >80°C (<10 psi) -Curing with fixture or pressure -Withstand >250°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4 -Proven reliability for multilayer stack	<4x10-⁴	>6.0	>2,000	-20	Tacky film Preforms 1.5 mils (thick) 3.0 mils (thick)
TP8550	-Wafer pre-application -Instant melt-bond >160°C (<10 psi) -No post curing -Withstand >150°C wire-bonding -Low moisture absorption -Meets MIL-STD-883F 5011.4	<4x10-⁴	>6.0	>1,500	-40	Tack free dry film Preforms 1.5 mils (thick) 3.0 mils (thick)
CXP888	-Wafer pre-application -Instant melt-bond >290°C (<10 psi) -Low coefficient of thermal expansion ->300°C continuous applications -High moisture resistance	<4x10-⁴	>6.0	>2,000	240	Tack free dry film Preforms 1.0 mils (thick) 2.0 mils (thick)

AIT offers many other Die Attach paste adhesives not shown on our web site. Please go to Products Application Form to receive a recommendation from our office on your specific application.

Die-attach-film (DAF) is engineered for "tack-and-cure" process. This allows for tacking the die onto the substrate with low temperature (80-160°C) and low pressure (4-8 psi) for short time (1-2 seconds). It then is followed by a curing process without pressure at a temperature that fits the manufacturing process.

AIT die-attach film adhesives are engineered to have a balance of high temperature bond strength to allow wire-bonding operations up to 275°C and low stress for larger dies.

DAF has a long history of success in performance under extreme temperature and humidity. The following graph is a reflection of the low moisture absorption and potential for packaging components for lead-free soldering without pre-baking.

DAF has more than 10 years of proven success in stacking multiple chips for high reliability applications. Part of the atributes for its success is the ability to withstand high temperature without degradation. The following graph illustrates the unparalleled molecular stability among DAF.