Flip-Chip Die-Attach and Interconnections with Flexible Conductive Adhesives:

◊       Patented and proven reliability of flip-chip interconnections with flexible conductive adhesive.
◊       Simple flip-chip attach process with conductive adhesive on substrate-interposer:
o        Stencil LRTC 8550 onto precious metal bond pads on substrate-interposer.
o        B-stage the adhesive at ambient to 60°C.
o        Place flip-chip with precious metal bond-pad or bumps onto the respective substrate-interposer.
o        Cure the device interconnection at temperature 80-200°C without applied pressure.
o        Optional underfill with flexible protection encapsulation (ME 7150 water-like viscosity for defect free underfilling).
◊       Alternative flip-chip attach process with conductive adhesive on wafer-chip:
o        Stencil ESS8450 (or PSS 8150) onto precious metal bond pads on wafer-chip.
o        B-stage the adhesive at ambient to 60°C.
o        Place flip-chip with conductive adhesive onto the respective substrate-interposer with precious metal bond-pad or bumps that is heated to above 200°C.
o        Cure the device interconnection at temperature 200°C without pressure.
o        Optional underfill with flexible protection encapsulation (me 7150 water-like viscosity for defect free underfilling).

◊        Adhesive absorbed less than 0.15% even at saturated moisture at 100°C. Devices have passed most stringent military specification for components.

◊       One of the most stable adhesive for high temperature exposures with TGA degradation well above 390°C

 

 

 

FLIP-CHIP FLEXIBLE CONDUCTOR ADHESIVE BUMPS
Solder Joint Replacement: Patent Pending
  
AIT Product
Resistivity
(ohm-cm)
Current Capability
(Amp/mm2)
Tg
(°C)
Die-Shear
 (psi)
Max. Temp.
(°C)
under load
 of 100 psi
Off-line Melt-Bonding
(@10psi after B-staging)
(Ag, Thermoplastic)
< 3x10-4
>20
-55
>1,000
150
Instant Melt-Bonding, >190° C
PSS8159
(Au, Thermoplastic)
 < 3x10-3
 >20
-55
>1,000
150 
Instant Melt-Bonding, >190° C 
(Ag, Flexible Epoxy)
 < 3x10-4
 >20
-60 
>2,000 
 250
Rapid-Curing Epoxy @>100° C 
(Pd, Flexible Epoxy)
< 3x10-3
 >20
 -60
>2,000 
 250
Rapid-Curing Epoxy @>100° C 
(Au, Flexible Epoxy)
 < 3x10-3
 >20
 -60
 >2,000
 250
 Rapid-Curing Epoxy @>100° C
Wafer & Substrate               Precision bumpings down to 50 micron bumps and 100 micron pitch
Bumping Services                Bump height of 50-75 micron for bump diameter of 50-75 micron
With Conductor-Adhesive       Clean-room operation for substrate panel of 12"x12"

 

 

 FLEXIBLE UNDERFILL FOR INSULATION & PROTECTION

 

AIT Product
Resistivity
(ohm-cm)
Dielectric Strength
(volt/mil)
Thermal Conductivity
(W/m-° C)
Tg
(°C)
Die Shear
(psi @  25°C
/150°C)
Modulus (psi)/ Poisson Ratio
Curing Conditions
MEE7650-5
(Flexible)
>1x10114
750
0.20
-30
1,000/50
6,000/0.45
125oC
10 min.
MEE7655-5
(Alumina epoxy)
>1x10114
750
1.6
-30
5,000/50
9,000/0.45
125oC
10 min.

 

AIT, solve my problem!