Printing Insulated Metal Substrate Copper Clads & Pre-Preg

Stress-Free Insulated Metal Substrate with Lowest Thermal Resistance for Large Area and High Power Modules

AIT patented (US patent#7,154,046; 6,717,819; 6,580,035; 6,581,276; 6,108,210; 6,297,564; 6,665,193; 6,973,716) applied to insulated metal substrates differs from traditional Insulated Metal Substrate thermal circuit substrate in the following aspects to give them the unparalleled thermal and reliability performance:

Instead of a thermally conductive rigid fiberglass epoxy laminate, we use our proprietary flexible thermal dielectric insulating layer resulting in stress and warp-free thermal copper-clad laminates.
Unparalleled thermal conductivity in the insulating layer by eliminating the fiberglass fabrics.
High temperature stability to withstand soldering at 300°C.
Multi-layer capability with the same flexible dielectric copper-clad pre-preg that can be laminated at less than 14 psi pressure and at 125°C or higher.
Base metal plates with choices of aluminum and copper from 35 mils to 350 mils.
Thinner insulated metal substrate and pre-preg are available in rolls of 12-inch width.
Thicker insulated metal substrate and pre-preg are available in sheets of 12-inch by 24-inch.
Ideal for power and LED components, modules.

Single-Sided Insulated Metal Substrate for Power & LED Modules

AIT Product	Characteristics	Copper Thickness (oz)	Thermal Resistance(^oC/W-in²)	Nominal Stack Thickness (mils)	Dielectric Strength of Insulating Layer (Volt/mil)	Dielectric Constant of Insulating Layer
COOL-CLAD^TM CC-AL-SS-1	-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300^oC soldering	1	<1.5	88	>1000	4.5
COOL-CLAD^TM CC-AL-SS-4	-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300^oC soldering	4	<1.5	162	>1000	3.9
COOL-CLAD^TM CC-AL-SS-10	-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300^oC soldering	10	<1.5	312	>1000	3.9
COOL-CLAD^TM CC-AL-SS-X	-Flexible thermal dielectric -Aluminum Clad -Ease of Machining -Withstand 300^oC soldering	Custom	<1.5	Custom	>1000	3.9
COOL-CLAD^TM CC-AL-OX-SS-10	-Flexible thermal dielectric -Aluminum Clad -Laser Machineable -Withstand 300^oC soldering	10	<1.5	312	>3000	3.9
COOL-CLAD^TM CC-AL-OX-SS-X	-Flexible thermal dielectric -Aluminum Clad -Laser Machineable -Withstand 300^oC soldering	Custom	<1.5	Custom	>3000	3.9

Double-Sided Copper-Clad Laminates for Power & LED Modules

AIT Product	Characteristics	Copper Thickness (oz)	Thermal Resistance( ^oC/W-in²)	Nominal Stack Thickness (mils)	Dielectric Strength of Insulating Layer (Volt/mil)	Dielectric Constant of Insulating Layer
COOL-CLAD^TM CC-CU-DS-1	-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300^oC soldering	1	<1.1	88	>1000	3.9
COOL-CLAD^TM CC-CU-DS-4	-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300^oC soldering	4	<1.1	162	>1000	3.9
COOL-CLAD^TM CC-CU-DS-10	-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300^oC soldering	10	<1.1	312	>1000	3.9
COOL-CLAD^TM CC-CU-DS-X	-Flexiblethermal dielectric -Copper-clad Base Plate -Ease of Machining -Withstand 300^oC soldering	Custom	<1.1	Custom	>1000	3.9
COOL-CLAD^TM CC-CU-OX-DS-X	-Flexiblethermal dielectric -Copper-clad Base Plate -Laser Machineable -Withstand 300^oC soldering	Custom	<1.1	Custom	>3000	3.9

Flexible Thermal Copper-clad Pre-preg for Power & LED Modules

AIT Product	Characteristics	Copper Thickness (oz)	Thermal Resistance(^oC/W-in²)	Nominal Stack Thickness (mils)	Dielectric Strength of Insulating Layer (Volt/mil)	Dielectric Constant of Insulating Layer
COUPLER^TM TPR-CU-1	-Flexible thermal dielectric -Lamination Flow @>125^oC and <14 psi -Withstand 300^oC soldering	1	<1.1	88	>1000	3.9
COUPLER^TM TPR-CU-2	-Flexible thermal dielectric -Lamination Flow @>125^oC and <14 psi -Withstand 300^oC soldering	2	<1.1	115	>1000	3.9
COUPER^TM TPR-CU-X	-Flexible thermal dielectric -Lamination Flow @>125^oC and <14 psi -Withstand 300^oC soldering	Custom	<1.1	Custom	>1000	3.9

SOLDERABLE FLEXIBLE CIRCUIT COPPER CLAD LAMINATE

(COUPLER-C)

Characteristics	Unit	Conditioning	Typical Values	Specification
Volume Resistivity	MΩ-cm	C-96/35/90	5X10⁷~5X10⁸	10⁶ ↑
Surface Resistivity	MΩ	C-96/35/90	5X10⁵~5X10⁶	10⁴ ↑
Permittivity 1 MHz	-	C-24/23/50	3.8-4.2	5.4 ↓
Loss Tangent 1 MHz	-	C-24/23/50	0/013-0.020	0.035 ↓
Arc Resistance	Sec	D-48/50 + D-0.5/23	100 ↑	60 ↑
Dielectric Breakdown	KV	D-48/50	45 ↑	40 ↑
Moisture Absorption	%	D-24/23	0.01-0.20	0.35 ↓
Flammability	-	C-24/23/50+E-24/125	94V0	94V0
Peel Strength 1oz	Lb/in	288ºC Solder Floating	8 ↑	8 ↑
Thermal Stress	Sec	288ºC Solder Dipping	600 ↑	300 ↑
Pressure Cooker (2 atm/120&