FILM AND PASTE DIE-ATTACH ADHESIVES FOR LARGE AND SMALL DIES
AI Technology, Inc. pioneered the use of flexible die-attach film and paste adhesives for larger dies in the early 1980s. The company has since found success in extending its adhesive line to have the widest selection in the industry. They have been designed for the combination of performance and manufacturing efficiency. The following are a few examples:
1. Rapid-curing die-attach adhesive paste for typical dies:
- Rapid curing at 150-250° C in seconds
- Maintains more than 300 psi bond strength @ 250° C for fast wire-bonding
- Molecularly engineered for low moisture absorption and high temperature stability
- Designed for dies less than 1 cm
- Examples: ME7635-RC, ME8630-RC
2. Rapid-curing die-attach adhesive paste for large dies:
- Rapid curing at 150-250° C in seconds
- Maintains more than 300 psi bond strength @ 150° C for typical wire-bonding
- Molecularly engineered for low moisture absorption and high temperature stability
- Designed for dies larger than 1 cm
- Examples: ME7655-RC, ME8650-RC
3. Rapid-curing die-attach film (DAF) adhesive for typical dies:
- Tacks at 80-150° C in seconds with minimal pressure of 4-8 psi
- Rapid curing without pressure at select temperature
- Maintains more than 300 psi bond strength @ 250° C for fast wire-bonding
- Molecularly engineered for low moisture absorption and high temperature stability
- Designed for dies less than 1 cm
- Examples: ESP7670-WL, ESP8680-WL
4. Rapid-curing die-attach film (DAF) adhesive for large dies:
- Tacks at 125-150° C in seconds with minimal pressure of 4-8 psi
- Rapid curing without pressure at select temperature
- Maintains more than 300 psi bond strength @ 150° C for typical wire-bonding
- Molecularly engineered for low moisture absorption and high temperature stability
- Designed for dies larger than 1 cm
- Examples: ESP7450-WL, ESP8450-WL
AIT technology has the capability of combining its UV-releasing dicing tape (UVR 200) and its rapid-curing in-line "Tack-and-Cure" die-attach film adhesive (ESP7670-WL) for the ultimate in manufacturability.
AIT Die-Attach Film (DAF) differs from the more traditional B-staged film adhesive with a different molecularly structure for fast melt-flow that allows for low temperature and low pressure tacking and then post-curing without pressure.
OTHER SPECIALTY DIE ATTACH APPLICATIONS
1. Screen-printable rapid-curing die-attach film (DAF) adhesive:
- Screen-printable
- Tacks at 80-150° C in seconds with minimal pressure of 4-8 psi with rapid curing without pressure at select temperature
- Alternative inline tack-and-curing at 250°C within seconds
- Maintains more than 300 psi bond strength @ 250° C for fast wire-bonding
- Molecularly engineered for low moisture absorption and high temperature stability
- Designed for dies less than 1 cm
- Examples: LESP7670-WL, LESP8680-WL
2. Ultra-high thermally conductive die-attach adhesive pastes:
- Proven for military electronics and thermal performance
- Molecularly engineered for high temperature stability
- Designed for large and small dies
- Examples: ME8456-DA, ME8650-RCT
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