Key Features of AIT Wafer Dicing Tapes:

• Release-on-demand by exposure to UV irradiation to enable pick up of largest of dies.
• Low ionic impurities and impart no contamination of metal ions from adhesive.
• Outstanding expandability to prevent contact damage to dies and wafer.
• Controlled bond strength and hydrophobic to enable dicing under water-jet without peeling or slippage.
• Compliance and supports the working environment of class 100 (ANSI 209b) requirements.

Functions and Benefits of AIT Dicing Tapes:

• Two grades of peel strength (250 and 500 gm/in) for both UV releasing type and non-UV releasing types: accommodate different dicing speeds and die sizes.
• Industry's unique high temperature dicing tape with both flexible substrate and adhesive to withstand temperature up to 250°C for post and pre-dicing operations.
• Suitable for dicing panels for packages, ceramics and glass components
• Support laser cutting besides traditional blade dicing.
• Maintaining stable peel strength for 12 months in original packaging to facilitate transportation of diced wafer and panels.

For more information and recommendation assistance, please contact AIT sales and engineering:

AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308