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AI Technology, Inc. Headquarters
AI Technology, Inc. Asian Operations and International Partners
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Welcome to the home of AI Technology, Inc. Kevin Chung, Ph.D. CEO
Mission Statement: It is the policy of the management of AI Technology, Inc. to provide products that meet the customer's needs! ◊ AIT has a proud history of providing leading edge solutions in electronic packaging with the use of advanced materials. With the pioneering use of molecularly flexible epoxy adhesives for die and substrate attaches in the 1980's, the benefits of using compliant and non-silicone adhesives have been proven with more than 25 years of outstanding reliability. The use of flexible epoxy adhesive film and paste adhesives for handling large bonding areas is now the accepted “golden rule” in managing interfacial stresses to enhance long-term semiconductor device reliability. |
AI Technology, Inc. is located in Princeton Junction, New Jersey where we share our headquarters with our sister company, AVANTE (AVANTE International Technology,Inc.). Our 52,000 square foot office, warehouse, and manufacturing complex is located on a 16 acre campus. We manufacture our products and service our customers to ISO 9001:2000 standards, having been accredited in 1999.
Since 1990s, AIT has maintained local staff for servicing customers in Hong Kong and China (Shenzhen). AIT also has a long history of working with local partners in Europe and other Asian countries. We welcome inquiries to work with local partners in providing the most reliable electronic adhesives, thermal interface materials, EMI shielding materials, flex circuit substrates, semi-conductor and wafer processing tapes and materials to enhance your productivity. Our engineering and sales marketing teams are trained to ensure your requirements are successful. For partnering information, please email ait@aitechnology.com.
We also invite companies to license the patented and patent pending solutions described in the website. Representing our entire staff, I would like to thank all of those that have provided opportunities to serve, and invite inquiries to use our innovations to benefit your electronics, microelectronics and semi-conductor packaging applications.
AIT provides one of the most comprehensive film and paste adhesive lines that help our customers build their products with ultimate reliability at the lowest cost of manufacturing. In the case of film adhesives besides having the first tacky epoxy film adhesive, AIT has a wide selection of self-supporting epoxy film adhesives without fiberglass that the company has pioneered. These products are engineered with the lowest temperature and pressure melt-flow properties to allow “Instant tack and cure without pressure”. This provides true inline processing for stacked chips and substrate attach applications.
The same inline productivity enhancements are also available in die and substrate paste adhesives that allow rapid curing at temperatures as low as 80°C.
In addition, molecularly flexible cross-linkable films have been incorporated with copper foil and are used to provide patented applications of flexible circuits and interposers.
Within this site you will find many patented lid-attach materials and solutions for MEMS and wafer level packaging applications. You will also find some of our specialty and the industry's first EMI bonding gasket and shielding solutions that build on our 30 years of conductive polymer technologies.
AIT has a team of experienced engineers, scientists, sales and service staff ready to serve your needs for any electronic and semi-conductor packaging material solutions. We pride ourselves to provide products that meet your needs.
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
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