AI Technology Application Analysis and Contact Request
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At AI Technology, we are dedicated to make your application a success. Application Analysis form below tells us what you are looking for and helps us recommend the right product for you. Application Analysis is also the first step in ordering sample for evaluation. So please take a moment to tell us what you need. All you have to do is click on a few options. We promise, it's fast and easy!
AI Technology Inc.
70 Washington Road
Princeton Junction, NJ 08550-1012
Phone: (800) 735-5040
Phone: (609) 799-9388
Fax: (609) 799-9308
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1. Customer Information:
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Name:
Address1:
Address2:
City:
State/Province:
Postal/Zip Code:
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Title:
Company/Division:
Country:
Phone:
Fax:
Email:
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2. Application Categorization (Please click one):
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Die-Attach (Conventional Back-Side)
Die-Attach (Flip Chip: Flexible Conductor Adhesive)
Component-Attach (SMT, Solder Replacement)
Component-Attach (Thermal "Underfill")
Substrate/Module-Attach (Conductive, Microwave)
Substrate/Module-Attach (Electrically Insulating)
Substrate/Module-Attach (Electrically Insulating) Mechanical Only
Substrate/Module-Attach (Electrically Insulating) Thermal Needed
Interface, Thermal (Heat-Sink, Enclosure)
Interface, Thermal (Heat-Sink, Enclosure) Interface Only
Interface, Thermal (Heat-Sink, Enclosure) Bonding Required
Interface, Electrical and Thermal
Interface, Electrical and Thermal Interface Only
Interface, Electrical and Thermal Bonding Required
Lid-Seal (Environmental Only)
Lid-Seal (EMI Included)
UV and Optical Adhesive/Coating/Potting
Liquid Coating/Potting-Encapsulation
Custom Material or Service (Please Specify)
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3. Dispensing Requirements (Please click one):
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Simple Needle Dispensing (Pressure-Time)
Volumetric Needle Dispensing (Positive Displacement)
Screen-Stenciling
Film (Preform, Sheet, Roll)
Other Dispensing Method (Please Specify Below)
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4. Bonding and Curing Conditions:
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Maximum Curing Temperature:
ºC
Maximum Curing Time:
Min/Hr (Please Specify)
Maximum Pressure (Film Adhesives Only):
psi |
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5. Technical Considerations:
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Bonding Area:
Dimension (e.g. 0.5 cm x 2.0 cm)
Adherends:
Material/Surface (e.g. Aluminum, FR4)
Electrical:
(Resistivity -cm, Dielectric Strength V/mil)
Power (If Any):
Watts (e.g. 30 Watts)
Highest Exposed Temperature:
ºC (e.g. 250, Wire-Bonding)
Lowest Exposed Temperature:
ºC (e.g. -40, Shipping)
Max Temp Under Load >100 psi:
ºC (e.g. 125 psi, Tensile; 100 psi, Shear)
Temperature Cycling:
ºC (e.g. -40/85, Commercial)
Other:
(e.g. NASA Outgassing, 883D/5011.2, HAST) |
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6. Annual Usage Volume:
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Material Volume (Specify Units):
(e.g. 1000 Grams, 125 Sheets) |
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7. Additional Questions:
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