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AI Technology Application Analysis and Contact Request

At AI Technology, we are dedicated to make your application a success. Application Analysis form below tells us what you are looking for and helps us recommend the right product for you. Application Analysis is also the first step in ordering sample for evaluation. So please take a moment to tell us what you need. All you have to do is click on a few options. We promise, it's fast and easy!

AI Technology Inc.
70 Washington Road
Princeton Junction, NJ 08550-1012
Phone: (800) 735-5040
Phone: (609) 799-9388
Fax: (609) 799-9308

China, AI Technology Inc.
Shenzhen, Guangdong, China
Phone: (0086) 755-83766778 and 83763739

1. Customer Information: (* Required Field)

Name: *

Address1:

Address2:

City:

State/Province:

Postal/Zip Code:
 Title:

Company/Division: *

Country:

Phone Number: *

Fax:

Email Address: *

2. Application Categorization (Please click one):

Die Attach (Conventional Back-Side)
Die Attach (Flip Chip)
Die Attach (DDAF, Wafer Level)
Dicing Tape
Grinding Tape
Insulated Metal Substrate for MCPCB (Thick Base Plate)
Insulated Metal Substrate for MCPCB (Flexible)
High Temperature Flexible Circuit Substrate
Thermal Adhesive Tape/Film
Thermal Adhesive Paste
Thermal Interface Pads (Phase Change, Conformable)
Thermal Interface Gap-Filling (Compressible)
Thermal Interface Greases/Gels
Substrate Attach
Component Attach
Substrate and Component Attach Underfill
Lid Sealing - Paste (Dispensing and Screenable)
Lid Sealing - Film and Preforms
Electromagnetic Shielding - Coating
Electromagnetic Shielding - Sealant
Electromagnetic Shielding - Metal Tape with PSA
Electromagnetic Shielding - SheetFilm (EMI/RFI)
Solar - Back Sheet (Insulated thermal backsheet)
Solar - Front Sheet
Solar - Tabbing Adhesive
SOLARTAB
Custom Material or Service (Please Specify)


3. Dispensing Requirements (Please click one):

Simple Needle Dispensing (Pressure-Time)
Volumetric Needle Dispensing (Positive Displacement)
Screen-Stenciling
Film (Preform, Sheet, Roll)
Other Dispensing Requirement (Please Specify Below)


4. Bonding and Curing Conditions (If Applicable):

Maximum Curing Temperature:
°C
Maximum Curing Time:
Min/Hr (Please Specify)
Maximum Pressure (Film Adhesives Only):
psi

5. Technical Considerations:

Bonding Area:
Dimension (e.g. 0.5 cm x 2.0 cm)
Bond Line or Material Thickness
Dimension
Adherents and Substrates:
Material/Surface (e.g. Aluminum, FR4)
Electrical (Conductive, Insulating, or Semi Conductive):
(Resistivity -cm, Dielectric Strength V/mil)
Power of Attached Device (If Any):
Watts (e.g. 30 Watts)
Highest Exposed Temperature:
°C (e.g. 250, Wire-Bonding)
Lowest Exposed Temperature:
°C (e.g. -40, Shipping)
Max Temp Under Load >100 psi:
°C (e.g. 125 psi, Tensile; 100 psi, Shear)
Temperature Cycling:
°C (e.g. -40/85, Commercial)
Other:
(e.g. NASA Outgassing, 883D/5011.2, HAST)

6. Annual Usage Volume:

Material Volume (Specify Units):
(e.g. 1000 Grams, 125 Sheets)

7. Additional Questions and Requirements:



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