Introduction:
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced material and adhesive solution for electronic interconnection and packaging. The company has a ISO9001:2000 certified manufacturing and R&D facility in the U.S. and a Far East Service Center in Hong Kong. The headquarters has more than 50,000 square feet of manufacturing facilities for its die and substrate attached adhesive films and pastes: thermal interface materials (TIM) including insulated metal substrates, gap-filling compressible phase-change pad, thermal gel, thermal grease and adhesive films and pastes; electromagnetic and radio frequency interference (EMI/RFI) mitigation material solutions including conductive gaskets, form-in-place (FIP) conductive gaskets, self-attached shielding covers/cans/lids, conductive caulks and adhesives; and advanced organic copper-clad laminates from 1/4 oz to 1 oz copper within a 16-acre campus in Princeton Junction, NJ.
AI Technology has more than 25 years experience in designing and manufacturing various forms of high performance “Stress-free” flexable adhesive films and pastes and materials for microelectronic packaging and thermal interface materials for thermal management applications. Our newest research has yielded higher performance and lower cost, solderable flexible circuit substrate material to replace polyimide-based organic copper-clad laminates in high frequency, RFID, and with low dielectric constant and loss and low moisture absorption in replacing PTFE substrate material in microwave circuits. Our technology and products include solvent-free die and substrate attach pastes and films, compressible gap-filling phase change thermal interface materials of thermal pads, thermal gels, thermal greases; polymer based Solder-Sub® flexible conductive adhesives for solder-replacement in fine-pitch interconnections; near-hermetic lid sealant for ceramic and metal covers and optical glass lids for opto-electronic sensors and devices; EMI Shielding gasket/adhesive/caulk materials, double-sided UV-release wafer grinding tapes and high temperature-static free dicing tapes.
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AIT application engineering, sales, chemists and material scientists are ready to serve your special needs and applications. Please inform us of your requirements using the contact/application assistance page:
AIT technical sales and service department can also be reached at: 1-609-799-9388 or 1-800-735-5040 (EST) and Fax: 609-799-9308
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